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Wideband horn antenna based on multi-substrate layer technology

科研成果: 期刊稿件文章同行评审

摘要

A metal horn antenna fed by a co-planner waveguide with ground (CPWG) is designed and fabricated. To integrate and connect other active elements of the system, the CPWG is designed by multi-substrate PCB technology. A transition in the PCB layer concatenating the CPWG and the microstrip line has provided a continuous structure to lead the electric field from RF circuit into the horn. A ridge waveguide is used to widen the bandwidth. The simulated and measured results show that the proposed antenna has a broad impedance bandwidth of 33.1% (from 20.5 to 28.6 GHz) for |S 11 |<–10 dB and the radiation patterns also satisfy the requirements over the bandwidth.

源语言英语
页(从-至)5-6
页数2
期刊Electronics Letters
55
1
DOI
出版状态已出版 - 10 1月 2019

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