TY - GEN
T1 - Wearable iFEMG Sensor for Muscle Strength Evaluation
AU - Zou, Peikai
AU - Wang, Junhan
AU - Li, Ruya
AU - Fan, Yubo
N1 - Publisher Copyright:
© 2024 IEEE.
PY - 2024
Y1 - 2024
N2 - To achieve portable, low-cost, long-term, and precise muscle activities monitoring for applications such as clinical rehabilitation and athletic training, we built a wearable sensing system that integrated high-sensitivity iontronic-FMG sensor and sEMG electrodes, which allowed us to gain a deeper insight into the bioelectrical activity and mechanical behavior of muscles. In order to verify the effectiveness of the system and explore the physiological mechanism of the FMG & sEMG fusion, we conducted a muscle strength test by using an ultrasound image as a clinical standard. The results revealed the correlation between FMG signal amplitude and muscle mechanical characteristics. Furthermore, muscle strength could be predicted accurately.
AB - To achieve portable, low-cost, long-term, and precise muscle activities monitoring for applications such as clinical rehabilitation and athletic training, we built a wearable sensing system that integrated high-sensitivity iontronic-FMG sensor and sEMG electrodes, which allowed us to gain a deeper insight into the bioelectrical activity and mechanical behavior of muscles. In order to verify the effectiveness of the system and explore the physiological mechanism of the FMG & sEMG fusion, we conducted a muscle strength test by using an ultrasound image as a clinical standard. The results revealed the correlation between FMG signal amplitude and muscle mechanical characteristics. Furthermore, muscle strength could be predicted accurately.
KW - Surface electromyography (sEMG)
KW - force myography (FMG)
KW - iontronic pressure sensing
KW - muscle strength
UR - https://www.scopus.com/pages/publications/85186670271
U2 - 10.1109/MEMS58180.2024.10439525
DO - 10.1109/MEMS58180.2024.10439525
M3 - 会议稿件
AN - SCOPUS:85186670271
T3 - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
SP - 469
EP - 472
BT - IEEE 37th International Conference on Micro Electro Mechanical Systems, MEMS 2024
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 37th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2024
Y2 - 21 January 2024 through 25 January 2024
ER -