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Visual–haptic attention fusion based flexible printed circuit position identification in industrial robotic mobile phone assembly

  • Zihan Tang
  • , Yongjia Zhao*
  • , Deming Luo
  • , Hang Pan
  • , Jinlong Chen
  • , Yongsong Zhan
  • , Minghao Yang*
  • *此作品的通讯作者
  • Beihang University
  • CAS - Institute of Automation
  • Guilin University of Electronic Technology

科研成果: 期刊稿件文章同行评审

摘要

Despite various methods in robotic operation, it remains a great challenge for industrial mobile phone flexible printed circuit (FPC) assembly due to the extremely stringent demand in position identification for the very tiny FPC assembly targets under strict assembly tolerance. To this end, this work proposes an accurate FPC position identification strategy in industrial robotic mobile phone assembly. The contributions of the work are concluded as follows: (1) we construct a Multi-Head Attention (MHA) architecture with the objective of encoding the visual–haptic information of the position into compact fusion presentations; (2) the distance and rotation errors between the ideal FPC position and the varying mismatched FPC positions around the correct one are connected to the Multi-Head Attention decoder information in a regression manner; (3) a dynamic weight averaging (DWA) strategy is adopted to adjust the weights in the loss calculations, which is able to achieve a better balance between the position and rotation errors in loss regression. Experiments were conducted on a practical FPC assembly platform. The results show that the proposed method can significantly improve the FPC location accuracy under the limited requirements of assembly attempts. The possibility exists that the proposed method applies to the real mobile phone assembly lines to reduce the labor burden in the near future.

源语言英语
文章编号114579
期刊Engineering Applications of Artificial Intelligence
175
DOI
出版状态已出版 - 1 7月 2026

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