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Using failure analysis techniques to identify key information of PHM

  • Maogong Jiang
  • , Guicui Fu
  • , Danyan Wang
  • , Dong Zhang
  • Beihang University

科研成果: 书/报告/会议事项章节会议稿件同行评审

摘要

Failure analysis (FA) is a basic and effective method to obtain the physical and failure information of electronic components and circuits. Most of these information can provide many useful evidences for prognostic and system health management (PHM) of electronic products. To obtain these information, many failure analysis techniques are used. This paper focuses on analyzing the relationship between FA techniques and PHM system. To test and verify the availability of the relationship between FA techniques and PHM system, a failure analysis case of an Intelligent Power Module (IPM) is used to study the relationship. This IPM contains six insulated gate bipolar transistors (IGBTs) and there are obvious burnout indications on most of them after failure. With the process of failure analysis, the key information, such as component's structure, sensitive parameters are identified. These results persuasively prove that FA techniques can provide much information to PHM system, including PoF and data-driven methods.

源语言英语
主期刊名Proceedings of 2015 Prognostics and System Health Management Conference, PHM 2015
编辑Tingdi Zhao, Michael G. Pecht, Shunong Zhang
出版商Institute of Electrical and Electronics Engineers Inc.
ISBN(电子版)9781467385534
DOI
出版状态已出版 - 12 1月 2016
活动Prognostics and System Health Management Conference, PHM 2015 - Beijing, 中国
期限: 21 10月 201523 10月 2015

出版系列

姓名Proceedings of 2015 Prognostics and System Health Management Conference, PHM 2015

会议

会议Prognostics and System Health Management Conference, PHM 2015
国家/地区中国
Beijing
时期21/10/1523/10/15

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