TY - JOUR
T1 - Ultrasonic-assisted bonding of Al2O3 ceramic, Cu, and 5056 aluminum alloy with Sn-Zn-Sb solders
AU - Wu, Yongchao
AU - Li, Hong
AU - Qu, Wenqing
AU - Zhang, Jie
AU - Zhuang, Hongshou
N1 - Publisher Copyright:
© 2019, International Institute of Welding.
PY - 2020/2/1
Y1 - 2020/2/1
N2 - Ceramic-metal composite components manufactured by brazing/soldering technology have broad application in industry due to their excellent properties. The present study investigated soldering of Al2O3 ceramic with Al2O3 ceramic, copper, and 5056 aluminum alloy respectively by using a new type Sn-Zn-Sb solder at 250 °C in air with the assistance of ultrasonic. Microstructure of the Sn-9Zn-xSb solders with various content of Sb was analyzed. And the effect of Sb content on ceramic/ceramic joint strength was studied. The microstructures of solder/substrate interfaces and the bonding mechanism were emphatically studied. A significantly new intermetallic phase, Zn4Sb3 is detected in the microstructure of solder while the content of Zn4Sb3 and β-Sn phases increased with the content of Sb element. During the soldering process, Sn-Zn-Sb solder was composed of liquid Sn-Zn alloy and solid ZnSb intermetallic phase, and the quasi-melting state of the solder was found to be the decisive factor in achieving reliable ceramic/solder bonds. There was no reaction layer at ceramic/solder interface, and the solder filled grooves on the ceramic surface to form a firm mechanical bonding, thus results in higher strength. Fractures occurred on the ceramic/solder interface and Zn4Sb3 particles were found embedded in ceramic side.
AB - Ceramic-metal composite components manufactured by brazing/soldering technology have broad application in industry due to their excellent properties. The present study investigated soldering of Al2O3 ceramic with Al2O3 ceramic, copper, and 5056 aluminum alloy respectively by using a new type Sn-Zn-Sb solder at 250 °C in air with the assistance of ultrasonic. Microstructure of the Sn-9Zn-xSb solders with various content of Sb was analyzed. And the effect of Sb content on ceramic/ceramic joint strength was studied. The microstructures of solder/substrate interfaces and the bonding mechanism were emphatically studied. A significantly new intermetallic phase, Zn4Sb3 is detected in the microstructure of solder while the content of Zn4Sb3 and β-Sn phases increased with the content of Sb element. During the soldering process, Sn-Zn-Sb solder was composed of liquid Sn-Zn alloy and solid ZnSb intermetallic phase, and the quasi-melting state of the solder was found to be the decisive factor in achieving reliable ceramic/solder bonds. There was no reaction layer at ceramic/solder interface, and the solder filled grooves on the ceramic surface to form a firm mechanical bonding, thus results in higher strength. Fractures occurred on the ceramic/solder interface and Zn4Sb3 particles were found embedded in ceramic side.
KW - Ceramic/metal bonding
KW - Interfacial microstructure
KW - Shear strength
KW - Sn-Zn-Sb solder
KW - Ultrasonic soldering
UR - https://www.scopus.com/pages/publications/85075219029
U2 - 10.1007/s40194-019-00815-z
DO - 10.1007/s40194-019-00815-z
M3 - 文章
AN - SCOPUS:85075219029
SN - 0043-2288
VL - 64
SP - 247
EP - 256
JO - Welding in the World, Le Soudage Dans Le Monde
JF - Welding in the World, Le Soudage Dans Le Monde
IS - 2
ER -