@inproceedings{fb1bc7e548b04f5f84f399551b029119,
title = "Two-parameter Capacitance Compensation for Quasi-ideal Directional Coupler Design in Package Substrate",
abstract = "A 3 dB half-hermetic packaged directional coupler is designed in multilayer package substrate using two-parameter capacitance compensation method in this paper. Two kinds of capacitance, which are only added to one of the two coupling lines, are introduced to solve port matching and coupling coefficient inequality between capacitive and inductive coupling. The designed 3 dB coupler has a relative bandwidth of 84\% with center frequency of 6 GHz within the range of ±1.5 dB amplitude imbalance and ± 0.6° phase deviation. The design can be directly mounted on printed circuit board and used for compact SoP applications.",
keywords = "SoP, capacitance compensation, directional coupler, multilayer package substrate, wideband",
author = "Chen Chen and Umar Dilshad and Jungang Miao",
note = "Publisher Copyright: {\textcopyright} 2019 IEEE.; 16th International Bhurban Conference on Applied Sciences and Technology, IBCAST 2019 ; Conference date: 08-01-2019 Through 12-01-2019",
year = "2019",
month = mar,
day = "13",
doi = "10.1109/IBCAST.2019.8667189",
language = "英语",
series = "Proceedings of 2019 16th International Bhurban Conference on Applied Sciences and Technology, IBCAST 2019",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "1017--1020",
booktitle = "Proceedings of 2019 16th International Bhurban Conference on Applied Sciences and Technology, IBCAST 2019",
address = "美国",
}