TY - GEN
T1 - TransOff
T2 - 43rd IEEE International Conference on Distributed Computing Systems, ICDCS 2023
AU - Hu, Zheyuan
AU - Niu, Jianwei
AU - Ren, Tao
N1 - Publisher Copyright:
© 2023 IEEE.
PY - 2023
Y1 - 2023
N2 - Mobile edge computing (MEC) has been proposed as a promising paradigm to provide mobile devices with both satisfactory computing capacity and task latency. One key issue in MEC is computation offloading (CompOff), which has attracted numerous research interests. Most existing CompOff approaches are developed based on iterative programming (IterProg), that calculates a CompOff action based on system dynamics each time mobile tasks arrive. Due to the heavy dependency of IterProg on reliable system dynamics, as well as the online computational burden, recent years have seen a popular trend to develop CompOff approaches based on deep reinforcement learning (DRL), which could generate real-time model-free CompOff actions. However, due to the intrinsic poor generalization of DRL, it is hard to directly apply DRL-based policies in new MEC environments, and long-time fine-tuning is often required. To address the challenge, this paper proposes a fast transferable CompOff framework (named TransOff), based on the idea of embedded reinforcement learning. Specifically, TransOff is composed of multiple primitive CompOff policies (pCOPs) and a multiplicative composition function (MCF). The pCOPs and MCF are pre-trained in a diverse variety of MEC environments. When encountering new MEC environments, pCOPs are kept fixed to prevent catastrophic forgetting of pre-trained CompOff skills, while only MCF is fine-tuned to produce new compositions of pCOPs to achieve fast transfer. We conduct extensive experiments via both numerical simulation and real testbed, indicating the fast transfer ability of TransOff compared to the state-of-the-art DRL-based and meta learning-based CompOff approaches.
AB - Mobile edge computing (MEC) has been proposed as a promising paradigm to provide mobile devices with both satisfactory computing capacity and task latency. One key issue in MEC is computation offloading (CompOff), which has attracted numerous research interests. Most existing CompOff approaches are developed based on iterative programming (IterProg), that calculates a CompOff action based on system dynamics each time mobile tasks arrive. Due to the heavy dependency of IterProg on reliable system dynamics, as well as the online computational burden, recent years have seen a popular trend to develop CompOff approaches based on deep reinforcement learning (DRL), which could generate real-time model-free CompOff actions. However, due to the intrinsic poor generalization of DRL, it is hard to directly apply DRL-based policies in new MEC environments, and long-time fine-tuning is often required. To address the challenge, this paper proposes a fast transferable CompOff framework (named TransOff), based on the idea of embedded reinforcement learning. Specifically, TransOff is composed of multiple primitive CompOff policies (pCOPs) and a multiplicative composition function (MCF). The pCOPs and MCF are pre-trained in a diverse variety of MEC environments. When encountering new MEC environments, pCOPs are kept fixed to prevent catastrophic forgetting of pre-trained CompOff skills, while only MCF is fine-tuned to produce new compositions of pCOPs to achieve fast transfer. We conduct extensive experiments via both numerical simulation and real testbed, indicating the fast transfer ability of TransOff compared to the state-of-the-art DRL-based and meta learning-based CompOff approaches.
KW - computation offloading
KW - deep reinforcement learning
KW - fast transfer
KW - mobile edge computing
UR - https://www.scopus.com/pages/publications/85175069841
U2 - 10.1109/ICDCS57875.2023.00071
DO - 10.1109/ICDCS57875.2023.00071
M3 - 会议稿件
AN - SCOPUS:85175069841
T3 - Proceedings - International Conference on Distributed Computing Systems
SP - 931
EP - 941
BT - Proceedings - 2023 IEEE 43rd International Conference on Distributed Computing Systems, ICDCS 2023
PB - Institute of Electrical and Electronics Engineers Inc.
Y2 - 18 July 2023 through 21 July 2023
ER -