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TransOff: Towards Fast Transferable Computation Offloading in MEC via Embedded Reinforcement Learning

  • Beihang University
  • Zhengzhou University
  • CAS - Institute of Software

科研成果: 书/报告/会议事项章节会议稿件同行评审

摘要

Mobile edge computing (MEC) has been proposed as a promising paradigm to provide mobile devices with both satisfactory computing capacity and task latency. One key issue in MEC is computation offloading (CompOff), which has attracted numerous research interests. Most existing CompOff approaches are developed based on iterative programming (IterProg), that calculates a CompOff action based on system dynamics each time mobile tasks arrive. Due to the heavy dependency of IterProg on reliable system dynamics, as well as the online computational burden, recent years have seen a popular trend to develop CompOff approaches based on deep reinforcement learning (DRL), which could generate real-time model-free CompOff actions. However, due to the intrinsic poor generalization of DRL, it is hard to directly apply DRL-based policies in new MEC environments, and long-time fine-tuning is often required. To address the challenge, this paper proposes a fast transferable CompOff framework (named TransOff), based on the idea of embedded reinforcement learning. Specifically, TransOff is composed of multiple primitive CompOff policies (pCOPs) and a multiplicative composition function (MCF). The pCOPs and MCF are pre-trained in a diverse variety of MEC environments. When encountering new MEC environments, pCOPs are kept fixed to prevent catastrophic forgetting of pre-trained CompOff skills, while only MCF is fine-tuned to produce new compositions of pCOPs to achieve fast transfer. We conduct extensive experiments via both numerical simulation and real testbed, indicating the fast transfer ability of TransOff compared to the state-of-the-art DRL-based and meta learning-based CompOff approaches.

源语言英语
主期刊名Proceedings - 2023 IEEE 43rd International Conference on Distributed Computing Systems, ICDCS 2023
出版商Institute of Electrical and Electronics Engineers Inc.
931-941
页数11
ISBN(电子版)9798350339864
DOI
出版状态已出版 - 2023
活动43rd IEEE International Conference on Distributed Computing Systems, ICDCS 2023 - Hong Kong, 中国
期限: 18 7月 202321 7月 2023

出版系列

姓名Proceedings - International Conference on Distributed Computing Systems
2023-July

会议

会议43rd IEEE International Conference on Distributed Computing Systems, ICDCS 2023
国家/地区中国
Hong Kong
时期18/07/2321/07/23

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