TY - GEN
T1 - Transmitting Sensitivity Enhancement of pMUTs via Releasing Residual Stress by V-Shaped Springs
AU - Chen, Xuying
AU - Chen, Dongyang
AU - Pang, Jintao
AU - Yang, Dengfei
AU - Huang, Manjuan
AU - Liu, Huicong
AU - Xie, Jin
N1 - Publisher Copyright:
© 2019 IEEE.
PY - 2019/1
Y1 - 2019/1
N2 - Residual stress can dramatically hamper the performance of piezoelectric micromachined ultrasound transducers (pMUTs), in particular the transmitting sensitivity. This paper reports a series of square pMUTs with enhanced transmitting sensitivity through V-shaped springs in different angles. The V-shaped springs can release the residual stress through self-deformation, which contributes to a flat vibrating membrane rather than a curved one. A flat vibrating membrane conduces to a large vibration amplitude. Consequently, the transmitting sensitivity of the pMUT with 150° V-shaped springs is measured as 50.9 nm/V, which is 203% higher than that of the pMUT without springs. The enhanced pMUTs have advantages in various applications of emission ultrasound.
AB - Residual stress can dramatically hamper the performance of piezoelectric micromachined ultrasound transducers (pMUTs), in particular the transmitting sensitivity. This paper reports a series of square pMUTs with enhanced transmitting sensitivity through V-shaped springs in different angles. The V-shaped springs can release the residual stress through self-deformation, which contributes to a flat vibrating membrane rather than a curved one. A flat vibrating membrane conduces to a large vibration amplitude. Consequently, the transmitting sensitivity of the pMUT with 150° V-shaped springs is measured as 50.9 nm/V, which is 203% higher than that of the pMUT without springs. The enhanced pMUTs have advantages in various applications of emission ultrasound.
UR - https://www.scopus.com/pages/publications/85074332850
U2 - 10.1109/MEMSYS.2019.8870710
DO - 10.1109/MEMSYS.2019.8870710
M3 - 会议稿件
AN - SCOPUS:85074332850
T3 - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
SP - 759
EP - 762
BT - 2019 IEEE 32nd International Conference on Micro Electro Mechanical Systems, MEMS 2019
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 32nd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2019
Y2 - 27 January 2019 through 31 January 2019
ER -