TY - CHAP
T1 - Transfer-printed devices for biomedical applications
AU - Liu, Changbo
AU - Sheng, Xing
N1 - Publisher Copyright:
© 2024 Elsevier Inc. All rights reserved.
PY - 2024/1/1
Y1 - 2024/1/1
N2 - The “transfer printing” method provides opportunities for the integration of brittle inorganic electronic materials and organic flexible/stretchable substrates which provides an array of opportunities for application in the biomedical field. This chapter introduces the recent advance in heterogeneously integrated materials and integrated inorganic devices for biomedical applications. The first part of the chapter describes materials including metals, oxides, silicon, wide bandgap semiconductors, two-dimensional materials, and biomaterials. The second part of the chapter describes functional devices including light-emitting diodess, photodetector, energy-harvesting devices, and bioresorbable materials and devices. This chapter introduces different fabrication methods for flexible bioelectronics and discusses their working mechanism.
AB - The “transfer printing” method provides opportunities for the integration of brittle inorganic electronic materials and organic flexible/stretchable substrates which provides an array of opportunities for application in the biomedical field. This chapter introduces the recent advance in heterogeneously integrated materials and integrated inorganic devices for biomedical applications. The first part of the chapter describes materials including metals, oxides, silicon, wide bandgap semiconductors, two-dimensional materials, and biomaterials. The second part of the chapter describes functional devices including light-emitting diodess, photodetector, energy-harvesting devices, and bioresorbable materials and devices. This chapter introduces different fabrication methods for flexible bioelectronics and discusses their working mechanism.
KW - Bioelectronics
KW - biodegradable electronics and transfer printing
KW - biosensor
KW - flexible electronics
KW - heterogeneous integration
UR - https://www.scopus.com/pages/publications/85191482574
U2 - 10.1016/B978-0-443-18845-9.00012-0
DO - 10.1016/B978-0-443-18845-9.00012-0
M3 - 章节
AN - SCOPUS:85191482574
SN - 9780443188442
SP - 279
EP - 323
BT - Transfer Printing Technologies and Applications
PB - Elsevier
ER -