"Top-Down" design flow and its applications in multi-vehicle communication system's EMC design

Ying Liu; Yong Jun Xie; Yong Zhang

doi:10.3969/j.issn.1001-0548.2010.05.016

"Top-Down" design flow and its applications in multi-vehicle communication system's EMC design

Ying Liu^*
, Yong Jun Xie
, Yong Zhang

^*此作品的通讯作者

电子信息工程学院

Xidian University
ANSYS, Inc.

科研成果: 期刊稿件 › 文章 › 同行评审

4 引用（Scopus）

摘要

The top-down electromagnetic compatibility (EMC) design flow and its applications in multi-vehicle communication system, which is based on EDA software, are introduced. For the EMC problems such as antenna interaction, enclosure leakage and radiation of printed circuit board (PCB) in a four-vehicle communication system, the design flow from system level and device level to PCB level is present with simulation procedure. The results show that this design flow can obviously improve the electromagnetic immunity of the system and make the design first pass success.

源语言	英语
页（从-至）	720-724
页数	5
期刊	Dianzi Keji Daxue Xuebao/Journal of the University of Electronic Science and Technology of China
卷	39
期	5
DOI	https://doi.org/10.3969/j.issn.1001-0548.2010.05.016
出版状态	已出版 - 9月 2010

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abstract = "The top-down electromagnetic compatibility (EMC) design flow and its applications in multi-vehicle communication system, which is based on EDA software, are introduced. For the EMC problems such as antenna interaction, enclosure leakage and radiation of printed circuit board (PCB) in a four-vehicle communication system, the design flow from system level and device level to PCB level is present with simulation procedure. The results show that this design flow can obviously improve the electromagnetic immunity of the system and make the design first pass success.",

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author = "Ying Liu and Xie, \{Yong Jun\} and Yong Zhang",

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AU - Xie, Yong Jun

AU - Zhang, Yong

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N2 - The top-down electromagnetic compatibility (EMC) design flow and its applications in multi-vehicle communication system, which is based on EDA software, are introduced. For the EMC problems such as antenna interaction, enclosure leakage and radiation of printed circuit board (PCB) in a four-vehicle communication system, the design flow from system level and device level to PCB level is present with simulation procedure. The results show that this design flow can obviously improve the electromagnetic immunity of the system and make the design first pass success.

AB - The top-down electromagnetic compatibility (EMC) design flow and its applications in multi-vehicle communication system, which is based on EDA software, are introduced. For the EMC problems such as antenna interaction, enclosure leakage and radiation of printed circuit board (PCB) in a four-vehicle communication system, the design flow from system level and device level to PCB level is present with simulation procedure. The results show that this design flow can obviously improve the electromagnetic immunity of the system and make the design first pass success.

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KW - Electromagnetic compatibility

KW - Shielding effect

KW - Top-down

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"Top-Down" design flow and its applications in multi-vehicle communication system's EMC design

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