@inproceedings{f4437ddcf7df486c898b01712b785079,
title = "Three dimemsional electro-thermal coupled Monte Carlo device simulation",
abstract = "3D paralleled electro-thermal coupled full band ensemble MC simulation platform is developed for analysis of local heating effect on performance and reliability of semiconductor devices. This new developed simulation platform provides a powerful tool for thermal-aware device and circuit design of nano scale devices.",
author = "Xiaoyan Liu and Kangliang Wei and Longxiang Yin and Gang Du and Hai Jiang and Kai Zhao and Lang Zeng and Xing Zhang",
note = "Publisher Copyright: {\textcopyright} 2014 IEEE.; 2014 12th IEEE International Conference on Solid-State and Integrated Circuit Technology, ICSICT 2014 ; Conference date: 28-10-2014 Through 31-10-2014",
year = "2014",
month = jan,
day = "23",
doi = "10.1109/ICSICT.2014.7021520",
language = "英语",
series = "Proceedings - 2014 IEEE 12th International Conference on Solid-State and Integrated Circuit Technology, ICSICT 2014",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
editor = "Jia Zhou and Ting-Ao Tang",
booktitle = "Proceedings - 2014 IEEE 12th International Conference on Solid-State and Integrated Circuit Technology, ICSICT 2014",
address = "美国",
}