摘要
In order to analyse and optimize the thermal design scheme of the three-axis Fiber Optic Gyroscope, this paper first discuss the internal thermal resource of three-axis Fiber Optic Gyroscope. Then the author build the simulation model for printed circuit board, which also has been analyzed and solved more, And the PCB's steady temperature distribution under the room temperature which compared with the result obtained from the infrared thermal scanner shows the correcting of the PCB model has been achieved. On the basis of this, simulate three-axis FOG, discover the problems that contains the temperature of the circuit board is too high and the odds of the distribution of fiber ring's temperature. Finally, a new improved method has been put forward. By simulating and calculation, the new method has been proved to solve all the problems above.
| 源语言 | 英语 |
|---|---|
| 页(从-至) | 930-934 |
| 页数 | 5 |
| 期刊 | Yuhang Xuebao/Journal of Astronautics |
| 卷 | 27 |
| 期 | 5 |
| 出版状态 | 已出版 - 9月 2006 |
指纹
探究 'Thermal simulation and research of satellite three-axis fiber optic gyroscope' 的科研主题。它们共同构成独一无二的指纹。引用此
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