Thermal Properties of Laser-Fabricated Copper–Carbon Composite Films on Polyimide Substrate

The growing demand for highly efficient heat management in flexible electronics requires fabrication of highly conductive flexible films. Herein, Cu–C film on a polyimide (PI) substrate is fabricated to form a layered Cu–C/PI composite conductive film using direct laser writing. Its oxidation resistance is significantly improved compared with the written Cu film due to the presence of a graphite shell on Cu particles in the Cu–C film. Furthermore, the Cu–C/PI composite film shows better thermal properties than Cu/PI. This work provides a one-step method for rapidly fabricating Cu/PI and Cu–C/PI composites with good thermal stability and conductivity.