TY - GEN
T1 - Thermal-mechanical reliability assessment of TSV structure for 3D IC integration
AU - Liu, Huan
AU - Zeng, Qinghua
AU - Guan, Yong
AU - Fang, Runiu
AU - Sun, Xin
AU - Su, Fei
AU - Chen, Jing
AU - Miao, Min
AU - Jin, Yufeng
N1 - Publisher Copyright:
© 2016 IEEE.
PY - 2017/2/21
Y1 - 2017/2/21
N2 - In this paper, thermal-mechanical reliability of TSV structure was investigated with thermal shock test and finite element method. The fine pitch TSV samples were subjected to thermal load, failure samples were identified by resistance measurement, the calculated characteristic life was about 340 cycles. It is revealed that thermal-mechanical stress is concentrated around TSV, the ends of TSV are susceptible to failure. FEA results indicate maximum value of maximum principal stress appears at chip area near the ends of TSV, scallop side wall induces larger shear stress than smooth side wall thus more easily leads to interfacial failure. The warpage of chips and fatigue life of solder balls under different thermal load conditions were investigated in global simulation.
AB - In this paper, thermal-mechanical reliability of TSV structure was investigated with thermal shock test and finite element method. The fine pitch TSV samples were subjected to thermal load, failure samples were identified by resistance measurement, the calculated characteristic life was about 340 cycles. It is revealed that thermal-mechanical stress is concentrated around TSV, the ends of TSV are susceptible to failure. FEA results indicate maximum value of maximum principal stress appears at chip area near the ends of TSV, scallop side wall induces larger shear stress than smooth side wall thus more easily leads to interfacial failure. The warpage of chips and fatigue life of solder balls under different thermal load conditions were investigated in global simulation.
UR - https://www.scopus.com/pages/publications/85016128437
U2 - 10.1109/EPTC.2016.7861584
DO - 10.1109/EPTC.2016.7861584
M3 - 会议稿件
AN - SCOPUS:85016128437
T3 - Proceedings of the 2016 IEEE 18th Electronics Packaging Technology Conference, EPTC 2016
SP - 758
EP - 764
BT - Proceedings of the 2016 IEEE 18th Electronics Packaging Technology Conference, EPTC 2016
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 18th IEEE Electronics Packaging Technology Conference, EPTC 2016
Y2 - 30 November 2016 through 3 December 2016
ER -