TY - GEN
T1 - Thermal Fatigue Life of Copper-Filled Laminated Micropore Based on Response Surface Methodology
AU - Li, Xiao Xiao
AU - Sun, Yu Feng
AU - Zhao, Guang Yan
N1 - Publisher Copyright:
© 2019 IEEE.
PY - 2019/8
Y1 - 2019/8
N2 - The copper-filled laminated micropore of the HDI board is the structural basis for the electrical interconnection between the conductive layers of the metal, and its quality determines the reliability of the HDI board. Due to the limitation of technology, it is unavoidable that there are microvoids in the micropore to cause stress concentration, which will greatly reduce the thermal fatigue life of the micropore. In order to study the life model of micropore with microvoid, the different characteristic parameters of microvoid in laminated micropore and the design parameters of HDI board were analyzed in this paper. Taking [3+6+3] the most common commercial HDI board as an example, based on the Box-Behnken experimental design principle, a continuous variable surface model with microporous strain as the response was established. The model can consider the influence of multiple variables in the process of HDI design and board acceptance. It can evaluate multiple factors affecting the micropore life and their interaction, and improve the efficiency and reliability of the design.
AB - The copper-filled laminated micropore of the HDI board is the structural basis for the electrical interconnection between the conductive layers of the metal, and its quality determines the reliability of the HDI board. Due to the limitation of technology, it is unavoidable that there are microvoids in the micropore to cause stress concentration, which will greatly reduce the thermal fatigue life of the micropore. In order to study the life model of micropore with microvoid, the different characteristic parameters of microvoid in laminated micropore and the design parameters of HDI board were analyzed in this paper. Taking [3+6+3] the most common commercial HDI board as an example, based on the Box-Behnken experimental design principle, a continuous variable surface model with microporous strain as the response was established. The model can consider the influence of multiple variables in the process of HDI design and board acceptance. It can evaluate multiple factors affecting the micropore life and their interaction, and improve the efficiency and reliability of the design.
KW - Copper-filled Micropore
KW - HDI board
KW - Microvoid
KW - Response Surface Methodology
KW - Thermal Fatigue Failure
UR - https://www.scopus.com/pages/publications/85082386310
U2 - 10.1109/QR2MSE46217.2019.9021261
DO - 10.1109/QR2MSE46217.2019.9021261
M3 - 会议稿件
AN - SCOPUS:85082386310
T3 - Proceedings of 2019 International Conference on Quality, Reliability, Risk, Maintenance, and Safety Engineering, QR2MSE 2019
SP - 378
EP - 384
BT - Proceedings of 2019 International Conference on Quality, Reliability, Risk, Maintenance, and Safety Engineering, QR2MSE 2019
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2019 International Conference on Quality, Reliability, Risk, Maintenance, and Safety Engineering, QR2MSE 2019
Y2 - 6 August 2019 through 9 August 2019
ER -