@inproceedings{93fc73fc4e254114a29c9d3a494c4f2b,
title = "The thermal contact resistance testing method study of thin film materials",
abstract = "The thermal contact resistance is an important parameter in the thermal analysis. As there are many factors affecting the thermal contact resistance, generally it is difficult to obtain commonly used computational model or formula. In engineering application, the thermal contact resistance of the solid interfaces is usually obtained by testing. Most of the references are researching the thermal contact resistance testing of the ordinary columnar materials. In this paper, the method of measuring the thermal contact resistance of the thin film materials is presented. Thin film material is testing objects, and it is not suitable for thermocouples to be embedded. The method in this paper is indirect measurement of the thermal contact resistance based on the steady state method. According to this method, we use copper heat flux meter, graphite columnar specimens and graphite thin film sample to measure the thermal contact resistance between the graphite thin film materials.",
keywords = "graphite thin film materials, heat flux, interface temperature drop, thermal contact resistance, thin film materials",
author = "Renxi Luo and Xiaogang Li and Qingyun Tang and Weifang Zhang",
note = "Publisher Copyright: {\textcopyright} 2015 IEEE.; Prognostics and System Health Management Conference, PHM 2015 ; Conference date: 21-10-2015 Through 23-10-2015",
year = "2016",
month = jan,
day = "12",
doi = "10.1109/PHM.2015.7380067",
language = "英语",
series = "Proceedings of 2015 Prognostics and System Health Management Conference, PHM 2015",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
editor = "Tingdi Zhao and Pecht, \{Michael G.\} and Shunong Zhang",
booktitle = "Proceedings of 2015 Prognostics and System Health Management Conference, PHM 2015",
address = "美国",
}