@inproceedings{1ecbad35411b4d26a90cac045e3e3e18,
title = "The SI and EMI analysis and pre-design of the sensor",
abstract = "The sensor is a multi-board system composed of backboard and other plugging boards. It is a crucial problem that how to assure the signal integrity (SI) for such a complex system. In this paper, we mainly discuss the various signal integrity plots of critical signals in digital circuit board and EMC problems in the multi-board sensor system. The SI and EMC conditions can be improved with the help of the simulations and analysis for the sensor system.",
keywords = "EMI, SI, multi-board, sensor",
author = "Yajing Han and Zhaowen Yan and Mingming Che and Tao Wang",
year = "2011",
doi = "10.1109/MAPE.2011.6156158",
language = "英语",
isbn = "9781424482665",
series = "Proceedings - 2011 4th IEEE International Symposium on Microwave, Antenna, Propagation and EMC Technologies for Wireless Communications, MAPE 2011",
pages = "566--569",
booktitle = "Proceedings - 2011 4th IEEE International Symposium on Microwave, Antenna, Propagation and EMC Technologies for Wireless Communications, MAPE 2011",
note = "2011 4th IEEE International Symposium on Microwave, Antenna, Propagation and EMC Technologies for Wireless Communications, MAPE 2011 ; Conference date: 01-11-2011 Through 03-11-2011",
}