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The Residual Strain Measurement of Thin Conductive Metal Wire after Electrical Failure with SEM Moiré

  • Yanjie Li
  • , Huimin Xie*
  • , Qinghua Wang
  • , Mengmeng Zhou
  • , Manqiong Xu
  • , Qiang Luo
  • , Changzhi Gu
  • *此作品的通讯作者
  • Tsinghua University
  • University of Jinan
  • National Institute of Advanced Industrial Science and Technology
  • CAS - Institute of Physics

科研成果: 期刊稿件文章同行评审

摘要

In this study, the residual strain of a thin conductive metal wire on a polymer substrate after electrical failure is measured with SEM moire. Focused ion beam (FIB) milling is applied to fabricate micron moire gratings on the surfaces of constantan wires and the random phase shifting technique is used to process moire fringes. The virtual strain method is briefly introduced and used to calculate the real strain of specimens. In order to study the influence of a defect on the electrical failure of the constantan wire, experiments were conducted on two specimens, one with a crack, while the other one without any crack. By comparing the results, we found that the defect makes the critical beam current of electrical failure decrease. In addition, the specimens were subjected to compression after electrical failure, in agreement with the observed crack closure of the specimen. The successful results demonstrate that the moire method is effective to characterize the full-field deformation of constantan wires on the polymer membrane, and has a good potential for further application to the deformation measurement of thin films.

源语言英语
页(从-至)371-378
页数8
期刊Acta Mechanica Solida Sinica
29
4
DOI
出版状态已出版 - 2016
已对外发布

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