TY - GEN
T1 - The influence of tackifier on the compression response and permeability of NCF
AU - Li, Yi
AU - Duan, Yuexin
AU - Zhao, Yan
AU - Lu, Xiaohua
PY - 2011
Y1 - 2011
N2 - To enhance the interlaminar fracture toughness of composites using the Vacuum-Infusion Process (VIP), a new type of thermoplastic particle was designed, which can act as stabilizer and tackifier in the fabrication process. These particles were incorporated onto the fabric's surface, and formed toughened interlaminar zones after the laminate was cured. The influence of tackifier on the compression response and permeability of a biaxial non-crimp stitched fabric (NCF) preform with several different ply-stacking sequences was investigated in this study. The influence of ply-stacking sequence on compression response and permeability was also discussed, which is associated with the influence of temperature on the compression response of NCF with tackifier.
AB - To enhance the interlaminar fracture toughness of composites using the Vacuum-Infusion Process (VIP), a new type of thermoplastic particle was designed, which can act as stabilizer and tackifier in the fabrication process. These particles were incorporated onto the fabric's surface, and formed toughened interlaminar zones after the laminate was cured. The influence of tackifier on the compression response and permeability of a biaxial non-crimp stitched fabric (NCF) preform with several different ply-stacking sequences was investigated in this study. The influence of ply-stacking sequence on compression response and permeability was also discussed, which is associated with the influence of temperature on the compression response of NCF with tackifier.
UR - https://www.scopus.com/pages/publications/80052056118
M3 - 会议稿件
AN - SCOPUS:80052056118
SN - 9781934551110
T3 - International SAMPE Technical Conference
BT - 2011 SAMPE Spring Technical Conference and Exhibition - State of the Industry
T2 - 2011 SAMPE Spring Technical Conference and Exhibition - State of the Industry: Advanced Materials, Applications, and Processing Technology
Y2 - 23 May 2011 through 26 May 2011
ER -