摘要
Using X-ray diffraction and Rutherford back-scattering techniques, a study has been made of the oxidation characteristics of copper thin films by Cr ion implantation. It is indicated that the implantation of Cr ions remarkably changes the Oxidation behavior and the copper oxide structures. Ion implantation suppresses the diffusion of copper atoms during oxidation and then inhibits the change of Cu20 to CuO. The formation mechanism of oxides before and after implantation was discussed.
| 源语言 | 英语 |
|---|---|
| 页(从-至) | 39-40+46 |
| 期刊 | Journal of Materials Engineering |
| 期 | 8 |
| 出版状态 | 已出版 - 2000 |
| 已对外发布 | 是 |
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