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The effect of impedance matching to high-speed connector's signal integrity

  • Mingmin Zhao*
  • , Donglin Su
  • , Fei Dai
  • , Shenqing Kuang
  • , Xiaoxiao Wang
  • *此作品的通讯作者
  • BHU

科研成果: 书/报告/会议事项章节会议稿件同行评审

摘要

The high-speed interconnection solutions have been used in almost all electronic products, so connector's signal transmission quality has also become a critical factor in the design of high-speed applications. Thus, in the design of high-speed connector applications, the impedance matching, cross talk, propagating delay and alignment shape of connector are important factors to be considered. The impedance matching is the prerequisite for solving the signal integrity, this paper proposes the impedance matching rule of high-speed connector through theoretical calculation and software simulation, thereby effectively resolving the problem of signal integrity which impedance mismatching leads to.

源语言英语
主期刊名ISAPE 2006 - 2006 7th International Symposium on Antennas, Propagation and EM Theory, Proceedings
1280-1283
页数4
出版状态已出版 - 2006
已对外发布
活动2006 7th International Symposium on Antennas, Propagation and EM Theory, ISAPE 2006 - Guilin, 中国
期限: 26 10月 200629 10月 2006

出版系列

姓名ISAPE 2006 - 2006 7th International Symposium on Antennas, Propagation and EM Theory, Proceedings

会议

会议2006 7th International Symposium on Antennas, Propagation and EM Theory, ISAPE 2006
国家/地区中国
Guilin
时期26/10/0629/10/06

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