TY - GEN
T1 - Techniques for nano-scale deformation measurement
AU - Fei, Su
AU - Sun, Yaofeng
AU - Shi, Xunqing
AU - Wong, Chee Khuen Stephen
PY - 2004
Y1 - 2004
N2 - Deformation measurement of mechanical-electrical devices is important for their reliability evaluation. However, with the development of fabrication technology, sizes of mechanical-electrical devices are reduced to micro or even nano-scale. Correspondingly, testing resolution of the required metrology techniques must be improved to the same or even higher level. The commonly used characterization facility with nano-scale resolution is STM/AFM/SEM etc. In this paper, some metrology technologies based on these facilities for nano-scale deformation measurement, e.g. AFM/SEM moiré and AFM/SEM digital speckle correlation are introduced, including their principles, advantages and disadvantages. Their applications in the deformation/strain measurement of MEMS and IC packages will be highlighted.
AB - Deformation measurement of mechanical-electrical devices is important for their reliability evaluation. However, with the development of fabrication technology, sizes of mechanical-electrical devices are reduced to micro or even nano-scale. Correspondingly, testing resolution of the required metrology techniques must be improved to the same or even higher level. The commonly used characterization facility with nano-scale resolution is STM/AFM/SEM etc. In this paper, some metrology technologies based on these facilities for nano-scale deformation measurement, e.g. AFM/SEM moiré and AFM/SEM digital speckle correlation are introduced, including their principles, advantages and disadvantages. Their applications in the deformation/strain measurement of MEMS and IC packages will be highlighted.
UR - https://www.scopus.com/pages/publications/28444462959
M3 - 会议稿件
AN - SCOPUS:28444462959
SN - 0780388216
SN - 9780780388215
T3 - Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004
SP - 729
EP - 734
BT - Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004
A2 - Toh, K.C.
A2 - Mui, Y.C.
A2 - How, J.
A2 - Pang, J.H.L.
T2 - 6th Electronics Packaging Technology Conference, EPTC 2004
Y2 - 8 December 2005 through 10 December 2005
ER -