跳到主要导航 跳到搜索 跳到主要内容

Study on rheological behavior of EPON862 epoxy resin system using resin transfer molding process

  • Z. Y. Liang*
  • , Y. X. Duan
  • , Y. Lin
  • , X. Y. Fan
  • , Z. G. Zhang
  • *此作品的通讯作者
  • Beihang University

科研成果: 期刊稿件文章同行评审

摘要

The rheological behavior of EPON862 epoxy resin system using resin transfer molding (RTM) process was studied with DSC analysis and viscosity experiments. A rheological model based on dual-Arrhenius equation was established and used to simulate rheological behavior of the resin. The estimated viscosity of the model is in good agreement with that of experiment. The processing window of the resin system can be well determined for the process based on the model. The optimum processing temperature of the resin for RTM process is 50°C, at which the resin can keep the viscosity less than 300 cP for 50 min. The model is important for performing simulation and quality control of RTM process for high performance composites.

源语言英语
页(从-至)16-19
页数4
期刊Fuhe Cailiao Xuebao/Acta Materiae Compositae Sinica
18
1
出版状态已出版 - 2月 2001

指纹

探究 'Study on rheological behavior of EPON862 epoxy resin system using resin transfer molding process' 的科研主题。它们共同构成独一无二的指纹。

引用此