@inproceedings{dfd752df87894669b92f78dca2c1d395,
title = "Study on MEMS board-level package reliability under high-G impact",
abstract = "Under high-G (104 g or above) impact load conditions, the reliability of micro electro mechanical systems (MEMS) board-level package and interconnection are critical concerned that influence the mission success of total projectile. This paper conducts a research on this problem to analyze package reliability using finite element modelling (FEM) and simulation method. Theoretical analysis and mathematical model for failure mechanism of MEMS package under high-G impact are conducted and established. A FEM dynamic analysis is conducted on a typical MEMS board-level leadless chip carrier (LCC) package. Results show that the solder joints are one of the key weakness points that influence the reliability of MEMS package. The maximum effective stress in the structure occurs at the outer corner in the outermost solder point, and the alloy cover and printed circuit board (PCB) have a greater deformation.",
author = "Jiuzheng Cui and Bo Sun and Qiang Feng and Zeng, \{Sheng Kui\}",
year = "2014",
language = "英语",
series = "Proceedings of the Annual Conference of the Prognostics and Health Management Society 2011, PHM 2011",
publisher = "Prognostics and Health Management Society",
pages = "463--468",
editor = "Abhinav Saxena and Sankalita Saha and Celaya, \{Jose R.\}",
booktitle = "Proceedings of the Annual Conference of the Prognostics and Health Management Society 2011, PHM 2011",
address = "美国",
note = "2011 Annual Conference of the Prognostics and Health Management Society, PHM 2011 ; Conference date: 25-09-2011 Through 29-09-2011",
}