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Solvent-assisted polymer-bonding lithography

  • Shifang Luan
  • , Rubo Xing
  • , Zhe Wang
  • , Xinhong Yu
  • , Yanchun Han*
  • *此作品的通讯作者
  • CAS - Changchun Institute of Applied Chemistry

科研成果: 期刊稿件文章同行评审

摘要

Solvent-assisted polymer-bonding lithography based on surface adhesion to the transfer pattern between the polymer films is presented. Its primary feature is the application of solvent vapor to enhance the adhesion between the polymers on the elastomeric polydimethylsiloxane mold and the substrate. When the mold is lifted off, the pattern is transferred to the substrate, assuming that the work of adhesion of the polymer/mold and the polymer/substrate was permitted. Solvent-assisted polymer-bonding lithography can fabricate micrometer and submicron patterns between the same and different polymers on the planar and nonplanar substrates at low temperatures and pressures.

源语言英语
页(从-至)236-241
页数6
期刊Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures
23
1
DOI
出版状态已出版 - 2005
已对外发布

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