TY - GEN
T1 - Sensitivity analysis of PCB's design parameters of the plated through hole
AU - Liu, Chenyan
AU - Hu, Weiwei
AU - Sun, Yufeng
PY - 2013
Y1 - 2013
N2 - As the demand grows for multiple functionality and high density, the reliability of plated through hole (PTH) becomes a concern because of the difficulty in small window plating. Choosing a favorable stress-strain model is an important part of PTH's reliability assessment. In this paper, the stress-strain model of Mirman and enhanced IPC (Association Connecting Electronics Industries) are considered to analyze the sensitivity of geometric parameters, the finite element analysis (FEA) data is used to verify the above results. In conclusion, the enhanced IPC model is more suitable for analyzing the influence of geometric parameters on PTH than Mirman model. And most of analysis results calculated by the enhanced IPC model are consistent with FEA's results. The analysis results also provide a reference for the selection of geometric parameters.
AB - As the demand grows for multiple functionality and high density, the reliability of plated through hole (PTH) becomes a concern because of the difficulty in small window plating. Choosing a favorable stress-strain model is an important part of PTH's reliability assessment. In this paper, the stress-strain model of Mirman and enhanced IPC (Association Connecting Electronics Industries) are considered to analyze the sensitivity of geometric parameters, the finite element analysis (FEA) data is used to verify the above results. In conclusion, the enhanced IPC model is more suitable for analyzing the influence of geometric parameters on PTH than Mirman model. And most of analysis results calculated by the enhanced IPC model are consistent with FEA's results. The analysis results also provide a reference for the selection of geometric parameters.
KW - finite element analysis
KW - PTH
KW - sensitivity analysis
KW - stress-strain model
UR - https://www.scopus.com/pages/publications/84890032664
U2 - 10.1109/QR2MSE.2013.6625629
DO - 10.1109/QR2MSE.2013.6625629
M3 - 会议稿件
AN - SCOPUS:84890032664
SN - 9781479910144
T3 - QR2MSE 2013 - Proceedings of 2013 International Conference on Quality, Reliability, Risk, Maintenance, and Safety Engineering
SP - 489
EP - 492
BT - QR2MSE 2013 - Proceedings of 2013 International Conference on Quality, Reliability, Risk, Maintenance, and Safety Engineering
T2 - 2013 International Conference on Quality, Reliability, Risk, Maintenance, and Safety Engineering, QR2MSE 2013
Y2 - 15 July 2013 through 18 July 2013
ER -