TY - GEN
T1 - Sensitivity analysis of factors influencing MEMS package reliability
AU - Cui, Jiuzheng
AU - Sun, Bo
AU - Feng, Qiang
PY - 2011
Y1 - 2011
N2 - The solder joint is one of the key weakness points that influence the reliability of MEMS package, for maximum stress-strain will be produced under high-g impact, which may result in plastic distortion or even crack in solder joint. Based on the dynamic analysis of Finite Element Model (FEM), sensitivity analysis is conducted on a typical MEMS package (Leadless Chip Carrier, LCC) for the dependence of the maximum stress of solder joint on design parameters such as structure material, geometry size and shape. The dependence of the maximum effective stress of solder joint on materials (PCB and solder) properties such as density and Young's modulus are discussed in detailed, and the Young's modulus (both of the PCB and solder joint) has a significant influence on the maximum stress of solder joins; The maximum stress of solder joint is found increase with the PCB width increasing, while decrease with the increasing of PCB thickness, and the PCB thickness has a significant influence; With the volume of the cavity increasing, the maximum stress of solder joint is found decrease; With the solder height increasing, the maximum stress of solder joint is found increase; With the cover thickness increasing, the maximum stress of solder joint is found decrease; the maximum stress of solder joint is smaller when the shape of PCB is round.
AB - The solder joint is one of the key weakness points that influence the reliability of MEMS package, for maximum stress-strain will be produced under high-g impact, which may result in plastic distortion or even crack in solder joint. Based on the dynamic analysis of Finite Element Model (FEM), sensitivity analysis is conducted on a typical MEMS package (Leadless Chip Carrier, LCC) for the dependence of the maximum stress of solder joint on design parameters such as structure material, geometry size and shape. The dependence of the maximum effective stress of solder joint on materials (PCB and solder) properties such as density and Young's modulus are discussed in detailed, and the Young's modulus (both of the PCB and solder joint) has a significant influence on the maximum stress of solder joins; The maximum stress of solder joint is found increase with the PCB width increasing, while decrease with the increasing of PCB thickness, and the PCB thickness has a significant influence; With the volume of the cavity increasing, the maximum stress of solder joint is found decrease; With the solder height increasing, the maximum stress of solder joint is found increase; With the cover thickness increasing, the maximum stress of solder joint is found decrease; the maximum stress of solder joint is smaller when the shape of PCB is round.
KW - MEMS package
KW - design parameters
KW - influencing factors
KW - reliability
KW - sensitivity analysis
UR - https://www.scopus.com/pages/publications/79960898822
U2 - 10.1109/PHM.2011.5939552
DO - 10.1109/PHM.2011.5939552
M3 - 会议稿件
AN - SCOPUS:79960898822
SN - 9781424479511
T3 - 2011 Prognostics and System Health Management Conference, PHM-Shenzhen 2011
BT - 2011 Prognostics and System Health Management Conference, PHM-Shenzhen 2011
T2 - 2011 Prognostics and System Health Management Conference, PHM-Shenzhen 2011
Y2 - 24 May 2011 through 25 May 2011
ER -