@inproceedings{9fa7cc17d7f545dbaefd03431587cd70,
title = "Research on physics-of-failure model for electromigration damage accumulation under multi-level stress profile based on accelerated factor",
abstract = "The problem which is paid attention in this paper is that existing physics-of-failure model cannot input and calculate complex multi-level stress environmental profile when making simulating calculation of microelectronic devices' using reliability. A physical model for electro-migration failure is analyzed as an example. We make cumulative calculation and improvement using theory of accelerated factor, and the general function of physics-of-failure model for electro-migration damage accumulation under multi-level stress profile is set up. This model can achieve simulation and prediction of cycle time before failure under multi-level stress profile. At the end of this paper, an instance of multi-level stress profile's calculation is provided.",
keywords = "accelerated factor, damage accumulation, electro-migration, formatting, multi-level stress",
author = "Bo Wan and Guicui Fu and Yanruoyue Li",
note = "Publisher Copyright: {\textcopyright} 2017 IEEE.; 2nd International Conference on Reliability Systems Engineering, ICRSE 2017 ; Conference date: 10-07-2017 Through 12-07-2017",
year = "2017",
month = sep,
day = "8",
doi = "10.1109/ICRSE.2017.8030728",
language = "英语",
series = "2017 2nd International Conference on Reliability Systems Engineering, ICRSE 2017",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
editor = "Dongming Fan and Jun Yang and Ziyao Wang and Tingdi Zhao",
booktitle = "2017 2nd International Conference on Reliability Systems Engineering, ICRSE 2017",
address = "美国",
}