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Research on packaging technology for fiber optical acoustic sensor

  • Rui Li*
  • , Wen Xiao
  • , Dong Yao
  • , Bingshi Xu
  • , Lin Cong
  • *此作品的通讯作者
  • Beihang University

科研成果: 书/报告/会议事项章节会议稿件同行评审

摘要

A micro acoustic sensor with inclined fibers was proposed to improve its sensitivity. In order to get the highest sensitivity within the micro structure, the relative positions of elements in sensor should be exactly located; especially the distance between fibers and membrane should be optimum. A packaging technology for this micro sensor assemblage and test is introduced. It is based on a packaging system composed of three parts: distance adjusting, intensity collection and data analysis. The distance adjusting part increases the operating distance with a step of 2μm. Meanwhile the received power is recorded by intensity collection part on line to get the intensity characteristic curve. Through the data analysis part, sensitivity curve, optimum operating distance, the highest sensitivity and optimum received power of the proposed acoustic sensor are got. An experiment was implemented to assemble and test a sensor whose angle between two fibers was 60° by the proposed packaging system. Its optimum operating distance and highest sensitivity were analyzed to be 30μm and 2.49μW/μm. The sensitivity of packaged sensor to standard acoustic signal is 16mV/Pa and SNR is tested to be 54dB.

源语言英语
主期刊名International Symposium on Photoelectronic Detection and Imaging 2009 - Material and Device Technology for Sensors
DOI
出版状态已出版 - 2009
活动International Symposium on Photoelectronic Detection and Imaging 2009: Material and Device Technology for Sensors - Beijing, 中国
期限: 17 6月 200919 6月 2009

出版系列

姓名Proceedings of SPIE - The International Society for Optical Engineering
7381
ISSN(印刷版)0277-786X

会议

会议International Symposium on Photoelectronic Detection and Imaging 2009: Material and Device Technology for Sensors
国家/地区中国
Beijing
时期17/06/0919/06/09

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