TY - GEN
T1 - Research on Application Development of Ultrasonic Data Acquisition System for Rail Flaw Detection
AU - Yuan, Haibin
N1 - Publisher Copyright:
© 2023 IEEE.
PY - 2023
Y1 - 2023
N2 - This paper describes the overall development and design of an embedded ultrasonic flaw detection system for rail flaw detection and management. Firstly, the principle and hardware framework of embedded ultrasonic detection is introduced. Subsequently, the development method and design of WDF-based USB driver and dynamic link library is explained. In the process of dynamic link library development, a new combined method of asynchronous IO operation, multi-threaded design, and multi-device sliding asynchronous operation is proposed. Finally, the modules of host computer GUI, the playback of waveform video, and the development and design process of DAC/AVG curve drawing module are introduced. The new developed flaw detection and management system is applied to metro track safety monitoring and health management effectively.
AB - This paper describes the overall development and design of an embedded ultrasonic flaw detection system for rail flaw detection and management. Firstly, the principle and hardware framework of embedded ultrasonic detection is introduced. Subsequently, the development method and design of WDF-based USB driver and dynamic link library is explained. In the process of dynamic link library development, a new combined method of asynchronous IO operation, multi-threaded design, and multi-device sliding asynchronous operation is proposed. Finally, the modules of host computer GUI, the playback of waveform video, and the development and design process of DAC/AVG curve drawing module are introduced. The new developed flaw detection and management system is applied to metro track safety monitoring and health management effectively.
KW - health management
KW - no-destructive detection
KW - rail damage
KW - ultrasonic flaw detection
UR - https://www.scopus.com/pages/publications/85174976555
U2 - 10.1109/ICEMI59194.2023.10270569
DO - 10.1109/ICEMI59194.2023.10270569
M3 - 会议稿件
AN - SCOPUS:85174976555
T3 - Proceedings of 2023 IEEE 16th International Conference on Electronic Measurement and Instruments, ICEMI 2023
SP - 429
EP - 433
BT - Proceedings of 2023 IEEE 16th International Conference on Electronic Measurement and Instruments, ICEMI 2023
A2 - Wu, Juan
A2 - Yin, Jiali
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 16th IEEE International Conference on Electronic Measurement and Instruments, ICEMI 2023
Y2 - 9 August 2023 through 11 August 2023
ER -