TY - GEN
T1 - Reliability Analysis of Circuit Board Based on Probability Box Failure Physical Model
AU - Zhang, Chuang
AU - Li, Xiang
AU - Fan, Xinlin
AU - Tang, Tian
AU - Qin, Yong
AU - Jia, Limin
AU - Wang, Zhipeng
N1 - Publisher Copyright:
© 2024, Beijing Paike Culture Commu. Co., Ltd.
PY - 2024
Y1 - 2024
N2 - This paper focuses on the issue of on-board circuit boards being prone to failure due to environmental factors such as vibration and heat during the actual operation of trains. Finite element simulation is conducted on the actual vibration data of the train, and it is considered that the distribution of heating components on the circuit board is unbalanced, which can lead to the uneven heat distribution of the entire circuit board during operation. Therefore, icepak is used for thermal simulation of the circuit board, using the results of thermal simulation as input for thermal fatigue simulation, the results show that the maximum equivalent stress and equivalent plastic strain are located between the electronic component and the solder joint. In addition, considering the effects of random uncertainty and cognitive uncertainty, a probability box failure physical model for weak components is established to complete reliability analysis at the component level in the circuit board.
AB - This paper focuses on the issue of on-board circuit boards being prone to failure due to environmental factors such as vibration and heat during the actual operation of trains. Finite element simulation is conducted on the actual vibration data of the train, and it is considered that the distribution of heating components on the circuit board is unbalanced, which can lead to the uneven heat distribution of the entire circuit board during operation. Therefore, icepak is used for thermal simulation of the circuit board, using the results of thermal simulation as input for thermal fatigue simulation, the results show that the maximum equivalent stress and equivalent plastic strain are located between the electronic component and the solder joint. In addition, considering the effects of random uncertainty and cognitive uncertainty, a probability box failure physical model for weak components is established to complete reliability analysis at the component level in the circuit board.
KW - Failure physical model
KW - Finite element modeling
KW - Probability box
KW - Reliability analysis
UR - https://www.scopus.com/pages/publications/85181761803
U2 - 10.1007/978-981-99-9319-2_34
DO - 10.1007/978-981-99-9319-2_34
M3 - 会议稿件
AN - SCOPUS:85181761803
SN - 9789819993185
T3 - Lecture Notes in Electrical Engineering
SP - 298
EP - 307
BT - Proceedings of the 6th International Conference on Electrical Engineering and Information Technologies for Rail Transportation (EITRT) 2023 - Advanced Information Enabling Technology for Rail Transportation
A2 - Gong, Ming
A2 - Jia, Limin
A2 - Qin, Yong
A2 - Liu, Zhigang
A2 - Yang, Jianwei
A2 - An, Min
PB - Springer Science and Business Media Deutschland GmbH
T2 - 6th International Conference on Electrical Engineering and Information Technologies for Rail Transportation, EITRT 2023
Y2 - 19 October 2023 through 21 October 2023
ER -