TY - GEN
T1 - Reliability Analysis For Thin Film Thermocouple Thermal Oxidation Failure Based On Interlayer Diffusion
AU - Chen, Zhikuan
AU - Sun, Yufeng
AU - Xue, Yuqing
N1 - Publisher Copyright:
© 2023 IEEE.
PY - 2023
Y1 - 2023
N2 - Thin-film thermocouples are temperature sensors with great potential for use in measuring the temperature of high-temperature components such ass turbine blades in aviation engines and gas turbines. At present, thin film thermocouples have low reliability and short life under high temperature conditions. The thermal oxidation failure of various film layers of thin film thermocouples is the main reason. This paper gives the thermal oxidation failure mechanism of the protective layer, sensitive layer and insulating layer of the thermocouple, analyzes the diffusion mechanism of each layer material on the interface under high temperature conditions, establishes the performance evaluation model of each film layer, and establishes the life model of the thin film thermocouple by giving its failure threshold. Finally, the life and reliability of thin film thermocouples are statistically solved by using Monte Carlo method.
AB - Thin-film thermocouples are temperature sensors with great potential for use in measuring the temperature of high-temperature components such ass turbine blades in aviation engines and gas turbines. At present, thin film thermocouples have low reliability and short life under high temperature conditions. The thermal oxidation failure of various film layers of thin film thermocouples is the main reason. This paper gives the thermal oxidation failure mechanism of the protective layer, sensitive layer and insulating layer of the thermocouple, analyzes the diffusion mechanism of each layer material on the interface under high temperature conditions, establishes the performance evaluation model of each film layer, and establishes the life model of the thin film thermocouple by giving its failure threshold. Finally, the life and reliability of thin film thermocouples are statistically solved by using Monte Carlo method.
KW - failure mechanism
KW - reliability analysis
KW - thermal oxidation
KW - thin film thermocouple
UR - https://www.scopus.com/pages/publications/85179523761
U2 - 10.1109/DSA59317.2023.00079
DO - 10.1109/DSA59317.2023.00079
M3 - 会议稿件
AN - SCOPUS:85179523761
T3 - Proceedings - 2023 10th International Conference on Dependable Systems and Their Applications, DSA 2023
SP - 565
EP - 574
BT - Proceedings - 2023 10th International Conference on Dependable Systems and Their Applications, DSA 2023
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 10th International Conference on Dependable Systems and Their Applications, DSA 2023
Y2 - 10 August 2023 through 11 August 2023
ER -