Preparation and near zero thermal expansion property of Mn 3Cu0.5A0.5N (A = Ni, Sn)/Cu composites

Lei Ding; Cong Wang; Yuanyuan Na; Lihua Chu; Jun Yan

doi:10.1016/j.scriptamat.2011.07.008

Preparation and near zero thermal expansion property of Mn ₃Cu_0.5A_0.5N (A = Ni, Sn)/Cu composites

Lei Ding
, Cong Wang^*
, Yuanyuan Na
, Lihua Chu
, Jun Yan

^*此作品的通讯作者

集成电路科学与工程学院

Beihang University

科研成果: 期刊稿件 › 文章 › 同行评审

66 引用（Scopus）

摘要

In this work, Mn₃Cu_0.5A_0.5N (A = Ni, Sn)/Cu composites with near zero thermal expansion property were successfully synthesized. It was found that the large positive thermal expansion of Cu can be effectively suppressed in the composite with the antiperovskite Mn ₃Cu_0.5A_0.5N (A = Ni, Sn). In particular, the composites show almost zero thermal expansion with a coefficient of thermal expansion of 4.7 × 10^-7 K^-1 in the temperature range 290-320 K. We suggest that this offers a new alternative for metal matrix composites with low and near zero thermal expansion properties.

源语言	英语
页（从-至）	687-690
页数	4
期刊	Scripta Materialia
卷	65
期	8
DOI	https://doi.org/10.1016/j.scriptamat.2011.07.008
出版状态	已出版 - 10月 2011

访问文件

10.1016/j.scriptamat.2011.07.008

其它文件与链接

链接到 Scopus 的出版物

引用此

@article{937684f372ee43719f2e599f4091306f,

title = "Preparation and near zero thermal expansion property of Mn 3Cu0.5A0.5N (A = Ni, Sn)/Cu composites",

abstract = "In this work, Mn3Cu0.5A0.5N (A = Ni, Sn)/Cu composites with near zero thermal expansion property were successfully synthesized. It was found that the large positive thermal expansion of Cu can be effectively suppressed in the composite with the antiperovskite Mn 3Cu0.5A0.5N (A = Ni, Sn). In particular, the composites show almost zero thermal expansion with a coefficient of thermal expansion of 4.7 × 10-7 K-1 in the temperature range 290-320 K. We suggest that this offers a new alternative for metal matrix composites with low and near zero thermal expansion properties.",

keywords = "Composites, MnXN/Cu, Near zero thermal expansion, Room temperature",

author = "Lei Ding and Cong Wang and Yuanyuan Na and Lihua Chu and Jun Yan",

year = "2011",

month = oct,

doi = "10.1016/j.scriptamat.2011.07.008",

language = "英语",

volume = "65",

pages = "687--690",

journal = "Scripta Materialia",

issn = "1359-6462",

publisher = "Acta Materialia Inc",

number = "8",

}

TY - JOUR

T1 - Preparation and near zero thermal expansion property of Mn 3Cu0.5A0.5N (A = Ni, Sn)/Cu composites

AU - Ding, Lei

AU - Wang, Cong

AU - Na, Yuanyuan

AU - Chu, Lihua

AU - Yan, Jun

PY - 2011/10

Y1 - 2011/10

N2 - In this work, Mn3Cu0.5A0.5N (A = Ni, Sn)/Cu composites with near zero thermal expansion property were successfully synthesized. It was found that the large positive thermal expansion of Cu can be effectively suppressed in the composite with the antiperovskite Mn 3Cu0.5A0.5N (A = Ni, Sn). In particular, the composites show almost zero thermal expansion with a coefficient of thermal expansion of 4.7 × 10-7 K-1 in the temperature range 290-320 K. We suggest that this offers a new alternative for metal matrix composites with low and near zero thermal expansion properties.

AB - In this work, Mn3Cu0.5A0.5N (A = Ni, Sn)/Cu composites with near zero thermal expansion property were successfully synthesized. It was found that the large positive thermal expansion of Cu can be effectively suppressed in the composite with the antiperovskite Mn 3Cu0.5A0.5N (A = Ni, Sn). In particular, the composites show almost zero thermal expansion with a coefficient of thermal expansion of 4.7 × 10-7 K-1 in the temperature range 290-320 K. We suggest that this offers a new alternative for metal matrix composites with low and near zero thermal expansion properties.

KW - Composites

KW - MnXN/Cu

KW - Near zero thermal expansion

KW - Room temperature

UR - https://www.scopus.com/pages/publications/80052268941

U2 - 10.1016/j.scriptamat.2011.07.008

DO - 10.1016/j.scriptamat.2011.07.008

M3 - 文章

AN - SCOPUS:80052268941

SN - 1359-6462

VL - 65

SP - 687

EP - 690

JO - Scripta Materialia

JF - Scripta Materialia

IS - 8

ER -

Preparation and near zero thermal expansion property of Mn 3Cu0.5A0.5N (A = Ni, Sn)/Cu composites

摘要

访问文件

其它文件与链接

指纹

引用此

Preparation and near zero thermal expansion property of Mn ₃Cu_0.5A_0.5N (A = Ni, Sn)/Cu composites