Packaged chalcogenide microsphere resonator with high Q-factor

Pengfei Wang; Ming Ding; Timothy Lee; Ganapathy Senthil Murugan; Lin Bo; Yuliya Semenova; Qiang Wu; Dan Hewak; Gilberto Brambilla; Gerald Farrell

doi:10.1063/1.4801474

Packaged chalcogenide microsphere resonator with high Q-factor

Pengfei Wang^*
, Ming Ding
, Timothy Lee
, Ganapathy Senthil Murugan
, Lin Bo
, Yuliya Semenova
, Qiang Wu
, Dan Hewak
, Gilberto Brambilla
, Gerald Farrell

^*此作品的通讯作者

University of Southampton
Technological University Dublin

科研成果: 期刊稿件 › 文章 › 同行评审

60 引用（Scopus）

摘要

The fabrication and characterization of a packaged As₂S ₃ microsphere resonator coupled to a tapered fiber using a low refractive index UV-curable polymer are reported. Embedding provides an efficient means to remove the highest order whispering gallery modes in the microsphere resonator, thus cleaning the resonator spectrum. At wavelengths near 1549.5 nm, high-Q modes up to 1.8 × 10⁵ can be efficiently excited in a 110 μm diameter chalcogenide microsphere via evanescent coupling from a 2 μm diameter tapered silica fiber. The device photosensitivity, useful for tuning, is still present and useable after the packaging process.

源语言	英语
文章编号	131110
期刊	Applied Physics Letters
卷	102
期	13
DOI	https://doi.org/10.1063/1.4801474
出版状态	已出版 - 1 4月 2013
已对外发布	是

访问文件

10.1063/1.4801474

其它文件与链接

链接到 Scopus 的出版物

引用此

@article{12267d69a74b484a9d6201e05f7ff464,

title = "Packaged chalcogenide microsphere resonator with high Q-factor",

abstract = "The fabrication and characterization of a packaged As2S 3 microsphere resonator coupled to a tapered fiber using a low refractive index UV-curable polymer are reported. Embedding provides an efficient means to remove the highest order whispering gallery modes in the microsphere resonator, thus cleaning the resonator spectrum. At wavelengths near 1549.5 nm, high-Q modes up to 1.8 × 105 can be efficiently excited in a 110 μm diameter chalcogenide microsphere via evanescent coupling from a 2 μm diameter tapered silica fiber. The device photosensitivity, useful for tuning, is still present and useable after the packaging process.",

author = "Pengfei Wang and Ming Ding and Timothy Lee and \{Senthil Murugan\}, Ganapathy and Lin Bo and Yuliya Semenova and Qiang Wu and Dan Hewak and Gilberto Brambilla and Gerald Farrell",

year = "2013",

month = apr,

day = "1",

doi = "10.1063/1.4801474",

language = "英语",

volume = "102",

journal = "Applied Physics Letters",

issn = "0003-6951",

publisher = "American Institute of Physics",

number = "13",

}

TY - JOUR

T1 - Packaged chalcogenide microsphere resonator with high Q-factor

AU - Wang, Pengfei

AU - Ding, Ming

AU - Lee, Timothy

AU - Senthil Murugan, Ganapathy

AU - Bo, Lin

AU - Semenova, Yuliya

AU - Wu, Qiang

AU - Hewak, Dan

AU - Brambilla, Gilberto

AU - Farrell, Gerald

PY - 2013/4/1

Y1 - 2013/4/1

N2 - The fabrication and characterization of a packaged As2S 3 microsphere resonator coupled to a tapered fiber using a low refractive index UV-curable polymer are reported. Embedding provides an efficient means to remove the highest order whispering gallery modes in the microsphere resonator, thus cleaning the resonator spectrum. At wavelengths near 1549.5 nm, high-Q modes up to 1.8 × 105 can be efficiently excited in a 110 μm diameter chalcogenide microsphere via evanescent coupling from a 2 μm diameter tapered silica fiber. The device photosensitivity, useful for tuning, is still present and useable after the packaging process.

AB - The fabrication and characterization of a packaged As2S 3 microsphere resonator coupled to a tapered fiber using a low refractive index UV-curable polymer are reported. Embedding provides an efficient means to remove the highest order whispering gallery modes in the microsphere resonator, thus cleaning the resonator spectrum. At wavelengths near 1549.5 nm, high-Q modes up to 1.8 × 105 can be efficiently excited in a 110 μm diameter chalcogenide microsphere via evanescent coupling from a 2 μm diameter tapered silica fiber. The device photosensitivity, useful for tuning, is still present and useable after the packaging process.

UR - https://www.scopus.com/pages/publications/84876135055

U2 - 10.1063/1.4801474

DO - 10.1063/1.4801474

M3 - 文章

AN - SCOPUS:84876135055

SN - 0003-6951

VL - 102

JO - Applied Physics Letters

JF - Applied Physics Letters

IS - 13

M1 - 131110

ER -

Packaged chalcogenide microsphere resonator with high Q-factor

摘要

访问文件

其它文件与链接

指纹

引用此