Optimal design of the magnetic field in a multi-target magnetron sputtering system

In magnetron sputtering, the magnetic field determines the sputtering stability, ionization rate, target utilization coefficient and films quality. Reasonable magnetic field distribution leads to a glow discharge distribution of desirable uniformity, hence improved target sputtering rate at different areas, extended sputtering area, prolonged target life and increased stability of the sputtering process. In this paper, the magnetic field of a hexagon target system is optimized by finite element method, and this provides a theoretic basis for optimization of the magnetron sputtering system.