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Non-Invasive IC RF Immunity Assessment Using Magnetic Field Injection Probe

  • Kunkun Hu*
  • , Zhaowen Yan
  • , Siyuan Ma
  • , Zhangqiang Ma
  • , Jianhao Ge
  • , Fuyu Zhao
  • *此作品的通讯作者
  • Beihang University

科研成果: 书/报告/会议事项章节会议稿件同行评审

摘要

Accurate evaluation of the radio-frequency (RF) immunity threshold of integrated circuits in complex electromagnetic environments is essential. Compared with the conventional direct power injection (DPI) method, the magnetic field injection probe (MFiP) enables non-intrusive measurement. This paper investigates the coupling model between the magnetic field probe and the PCB transmission line, analyzing the correlation between the induced voltage and the magnetic field strength. A microprocessor supervisory circuit chip is used as the device under test to validate the application of the MFiP in chip-level RF immunity testing. By utilizing the calibration factor and field distribution of the MFiP, a relationship between the immunity threshold and the injected signal voltage is established and compared with the traditional DPI method. Results demonstrate that the MFiP can reproduce the same susceptibility phenomena as the DPI method while also obtaining frequency-dependent immunity thresholds, showing its potential as a non-destructive alternative to DPI.

源语言英语
主期刊名2026 International Conference on Electronics, Information, and Communication, ICEIC 2026
出版商Institute of Electrical and Electronics Engineers Inc.
ISBN(电子版)9798331580773
DOI
出版状态已出版 - 2026
活动2026 International Conference on Electronics, Information, and Communication, ICEIC 2026 - Macau, 中国
期限: 18 1月 202621 1月 2026

出版系列

姓名2026 International Conference on Electronics, Information, and Communication, ICEIC 2026

会议

会议2026 International Conference on Electronics, Information, and Communication, ICEIC 2026
国家/地区中国
Macau
时期18/01/2621/01/26

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