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Multifunctional Hydrogel Interfaces: Reshaping the Future of Flexible Electronics

  • Boya Song
  • , Jing Zhang
  • , Sanwei Hao*
  • , Changyou Shao*
  • , Peng Fu
  • , Jialong Wen
  • , Jun Yang
  • , Hailin Cong*
  • , Caofeng Pan*
  • *此作品的通讯作者
  • Shandong University of Technology
  • Beijing Forestry University
  • Dalian Polytechnic University
  • Zaozhuang University

科研成果: 期刊稿件文献综述同行评审

摘要

Flexible electronics is undergoing a transition from single-function devices to intelligent systems capable of multimodal perception and closed-loop operation. Multifunctional hydrogels have emerged as a core platform for next-generation electronics, owing to their structural tailorability, biomimetic compatibility, dynamic responsiveness, and exceptional interfacial properties. This review outlines a cross-scale design pathway of hydrogel electronics spanning molecular strategies and microstructural architectures to macroscopic functionalities (mechano-electro-thermo-chemical responses) and system-level integration. We critically survey recent advancements in hydrogel-based applications, including wearable health monitoring, electronic skin, soft robotics, and self-powered devices, highlighting their unique advantages in high-fidelity signal acquisition, autonomous energy management, and long-term stability under complex conditions. Furthermore, we explore how AI-driven inverse design, digital twins, and in situ characterization are accelerating the shift from empirical to model-driven development of hydrogel electronics. A performance evaluation framework based on the “energy–signal coupling coefficient” is introduced, combining with green design principles promoting circular sustainability. Finally, we outline future challenges and opportunities to achieve extreme environmental adaptability and promote standardization and scalable manufacturing. Interdisciplinary integration and AI-assisted multimodal data analytics will ultimately advance hydrogel electronics from functional devices to fully intelligent bio-integrated systems.

源语言英语
文章编号e20644
期刊Advanced Materials
38
13
DOI
出版状态已出版 - 3 3月 2026

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