TY - GEN
T1 - Modeling and impedance analysis of power distribution network in 3D ICs with TSVs
AU - Zhang, Wei
AU - Yan, Zhaowen
AU - Wu, Chunyu
AU - Wang, Jianwei
N1 - Publisher Copyright:
© 2017 IEEE.
PY - 2017/10/20
Y1 - 2017/10/20
N2 - This paper focuses on the modeling and analysis of different power distribution network (PDN) structures in 3D TSV ICs, including 3D full wave model and equivalent circuit model. In addition, a simplified equivalent circuit model of stacked PDN is proposed to analysis aspects influencing stacked PDN impedance, such as number of ground TSVs, number of TSV pairs and number of stacked layers. Analyses about how these aspects influencing total capacitance, inductance of stacked PDN and causing resonance in PDN self-impedance (Z11) are made in detail. What's more, power noise in different stacked PDN structures is calculated and analyzed in time domain to evaluate their power integrity features. Analysis in this paper can offer instructions for the design and analysis of on-chip PDN.
AB - This paper focuses on the modeling and analysis of different power distribution network (PDN) structures in 3D TSV ICs, including 3D full wave model and equivalent circuit model. In addition, a simplified equivalent circuit model of stacked PDN is proposed to analysis aspects influencing stacked PDN impedance, such as number of ground TSVs, number of TSV pairs and number of stacked layers. Analyses about how these aspects influencing total capacitance, inductance of stacked PDN and causing resonance in PDN self-impedance (Z11) are made in detail. What's more, power noise in different stacked PDN structures is calculated and analyzed in time domain to evaluate their power integrity features. Analysis in this paper can offer instructions for the design and analysis of on-chip PDN.
KW - 3D ICs
KW - Impedance analysis
KW - PDN
KW - Power noise analysis
UR - https://www.scopus.com/pages/publications/85039174346
U2 - 10.1109/ISEMC.2017.8077888
DO - 10.1109/ISEMC.2017.8077888
M3 - 会议稿件
AN - SCOPUS:85039174346
T3 - IEEE International Symposium on Electromagnetic Compatibility
SP - 321
EP - 326
BT - 2017 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMCSI 2017 - Proceedings
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2017 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMCSI 2017
Y2 - 7 August 2017 through 11 August 2017
ER -