TY - GEN
T1 - Modeling and analysis of a climbing platform based on inter-digital electrode adhesion film
AU - Liu, Chenying
AU - Wang, Shaoping
AU - Xu, Shaochen
AU - Wang, Haitao
AU - Luo, Xuesong
N1 - Publisher Copyright:
© 2018 IEEE.
PY - 2018/10/5
Y1 - 2018/10/5
N2 - Electrostatic adhesion has been demonstrated superiority on climbing robots. Scholars have successfully applied electrostatic technology as adhesion devices on wall-climbing robots. However, previous researches still have limits in principles and performances. To further achieve larger force and more stable adhesion, an analytical model of adhesion film, based on inter-digital electrodes, is proposed in this paper. Coulomb's Law and vfrtual displacement method are employed to calculate adhesion force. Building further on this foundation, a wall-climbing platform based on electrostatic adhesion is developed and fabricated. Well-designed experiments have validated accuracy of the proposed model. Experimental results show that the proposed platform has great advantages in payload velocity compared with previous studies.
AB - Electrostatic adhesion has been demonstrated superiority on climbing robots. Scholars have successfully applied electrostatic technology as adhesion devices on wall-climbing robots. However, previous researches still have limits in principles and performances. To further achieve larger force and more stable adhesion, an analytical model of adhesion film, based on inter-digital electrodes, is proposed in this paper. Coulomb's Law and vfrtual displacement method are employed to calculate adhesion force. Building further on this foundation, a wall-climbing platform based on electrostatic adhesion is developed and fabricated. Well-designed experiments have validated accuracy of the proposed model. Experimental results show that the proposed platform has great advantages in payload velocity compared with previous studies.
KW - Electrostatic adhesion
KW - Inter-digital electrode
KW - Virtual displacement method
KW - Wall-climbing platform
UR - https://www.scopus.com/pages/publications/85056321695
U2 - 10.1109/ICMA.2018.8484358
DO - 10.1109/ICMA.2018.8484358
M3 - 会议稿件
AN - SCOPUS:85056321695
T3 - Proceedings of 2018 IEEE International Conference on Mechatronics and Automation, ICMA 2018
SP - 1269
EP - 1274
BT - Proceedings of 2018 IEEE International Conference on Mechatronics and Automation, ICMA 2018
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 15th IEEE International Conference on Mechatronics and Automation, ICMA 2018
Y2 - 5 August 2018 through 8 August 2018
ER -