TY - GEN
T1 - Machine Vision Applied to Backscattered Electron Imaging
AU - Huang, Junyuan
AU - Zhang, Wei
AU - Chen, Jingyun
N1 - Publisher Copyright:
© 2023 IEEE.
PY - 2023
Y1 - 2023
N2 - Electron beam processing usually needs to be carried out in a vacuum environment. The influence of high temperature and high concentration of metal vapor makes it difficult for traditional machine vision observation systems to perform long-Term observation. In this paper, a machine vision algorithm was used, a quadrupole plate sensor and image fusion algorithm were adopted, and the combination of software and hardware was realized. Finally, we solved the problems of scale imbalance and slice model scanning order in the imaging process and successfully realized clear observation of the surface in all directions. The backscattered electron signal imaging technology has been successfully applied to the electron beam processing process, which meets the online observation requirements of the electron beam processing process.
AB - Electron beam processing usually needs to be carried out in a vacuum environment. The influence of high temperature and high concentration of metal vapor makes it difficult for traditional machine vision observation systems to perform long-Term observation. In this paper, a machine vision algorithm was used, a quadrupole plate sensor and image fusion algorithm were adopted, and the combination of software and hardware was realized. Finally, we solved the problems of scale imbalance and slice model scanning order in the imaging process and successfully realized clear observation of the surface in all directions. The backscattered electron signal imaging technology has been successfully applied to the electron beam processing process, which meets the online observation requirements of the electron beam processing process.
KW - Backscatter electron imaging
KW - Electron beam processing
KW - Machine vision
UR - https://www.scopus.com/pages/publications/85180543609
U2 - 10.1109/PRAI59366.2023.10332056
DO - 10.1109/PRAI59366.2023.10332056
M3 - 会议稿件
AN - SCOPUS:85180543609
T3 - 2023 IEEE 6th International Conference on Pattern Recognition and Artificial Intelligence, PRAI 2023
SP - 650
EP - 653
BT - 2023 IEEE 6th International Conference on Pattern Recognition and Artificial Intelligence, PRAI 2023
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 6th IEEE International Conference on Pattern Recognition and Artificial Intelligence, PRAI 2023
Y2 - 18 August 2023 through 20 August 2023
ER -