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Luminous flux modeling for high power LED automotive headlamp module

  • Chaohua Yu
  • , Jiajie Fan*
  • , Cheng Qian
  • , Xuejun Fan
  • , Guoqi Zhang
  • *此作品的通讯作者
  • Hohai University Changzhou
  • Changzhou Institute of Technology Research for Solid State Lighting
  • Delft University of Technology
  • Lamar University

科研成果: 书/报告/会议事项章节会议稿件同行评审

摘要

The development of automotive lighting systems with high illumination quality and high reliability is essential for driving safe and comfort. LEDs have many superiorities over the traditional light sources, such as high reliability, good color quality, long lifetime, energy and space saving, environment friendly and so on, when they are operated under an effective health management (such as thermal, electrical and optical managements). In the recent decades, LEDs have been widely applied in automotive as dashboard lightings, interior and exterior signal lightings. However, when they are introduced as a light source into automotive headlight system, LEDs must be required to have both high luminous flux (>1000 lm for low beam) and high thermal stability, because automotive headlamps are always installed near engine and their typical ambient temperature is about 80°C. The luminous flux model has often been used to describe the light output behavior of a LED as function of the driven current (If) and junction temperature (Tj), which can be used to represent LED's state of performance. This paper introduces the luminous flux model for a high power LED automotive headlamp module. Firstly, the junction temperatures of LED modules are estimated and verified under the conditions of different driven currents and case temperatures (Tc). The characterization data with the measured luminous flux (Φ), the estimated Tj and If are then used to estimate the coefficients in the luminous flux models with the Goodness-of-Fit method. The result shows that the modified luminous flux model can describe the actual nonlinearity of LED's luminous flux when it is operated at the condition of high temperature and high driven current.

源语言英语
主期刊名18th International Conference on Electronic Packaging Technology, ICEPT 2017
编辑Chenxi Wang, Yanhong Tian, Tianchun Ye
出版商Institute of Electrical and Electronics Engineers Inc.
1389-1395
页数7
ISBN(电子版)9781538629727
DOI
出版状态已出版 - 19 9月 2017
已对外发布
活动18th International Conference on Electronic Packaging Technology, ICEPT 2017 - Harbin, 中国
期限: 16 8月 201719 8月 2017

出版系列

姓名18th International Conference on Electronic Packaging Technology, ICEPT 2017

会议

会议18th International Conference on Electronic Packaging Technology, ICEPT 2017
国家/地区中国
Harbin
时期16/08/1719/08/17

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