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Lifetime prediction based on analytical multi-physics simulation for light-emitting diode (LED) systems

  • Beihang University
  • State Key Laboratory of Solid State Lighting

科研成果: 书/报告/会议事项章节会议稿件同行评审

摘要

A novel method based on the analytical multi-physics simulation to predict the lifetime for LED systems is presented in this paper. LED is a typical multidisciplinary system that transfers electrical input into photonic output, and lifetime prediction is a must for new electronic device before releasing to market. The lifetime feature of LED systems is closely connected to the power, thermal, and optical parameters, but there is rare method concerning all these features to conduct lifetime prediction. In this paper, an original concept, Lumen Impulse (referred as LI), is proposed, which combines the lifetime and performance parameters together to indicate the accumulation of luminous flux in the time domain. With LI being regarded as an objective function, multidisciplinary design optimization (MDO) method is employed to solve the coupling formulas, the lifetime with higher precision can be obtained subsequently. The impacts of certain design parameters in LED systems on the lifetime and LI are discussed to present suggestions for the enhancement of lifetime performance of the LED systems. This research result will be helpful for manufactures and designers to predict the lifetime with higher accuracy and determine a most qualified operating point of LED systems.

源语言英语
主期刊名2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2017
出版商Institute of Electrical and Electronics Engineers Inc.
ISBN(电子版)9781509043446
DOI
出版状态已出版 - 10 5月 2017
活动18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2017 - Dresden, 德国
期限: 3 4月 20175 4月 2017

出版系列

姓名2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2017

会议

会议18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2017
国家/地区德国
Dresden
时期3/04/175/04/17

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