TY - GEN
T1 - Lifetime prediction and impact factors analysis of ball grid array solder joint based on FEA
AU - Ying, Chen
AU - Zebing, Hou
AU - Rui, Kang
PY - 2010
Y1 - 2010
N2 - In electronic product, reliability of solder joint has big impact on the function of the whole electronic product. In the design period of the package, it is important to predict solder joint thermal fatigue lifetime and analyze the effect of each factors on the lifetime of solder joint. Finite Element Analysis (FEA) based solder joint lifetime prediction method, which used Anand viscoplastic constitutive function and Darveaux lifetime perdition model is programmed use Visual Basic language. With this software, effect of temperature, solder material, height, diameter and gap of solder joint, thickness, Young's modulus and CTE of substrate on solder joint lifetime are analyzed. Results show that these factors have different effect on solder joint life which is benefit to the optimization of package structure.
AB - In electronic product, reliability of solder joint has big impact on the function of the whole electronic product. In the design period of the package, it is important to predict solder joint thermal fatigue lifetime and analyze the effect of each factors on the lifetime of solder joint. Finite Element Analysis (FEA) based solder joint lifetime prediction method, which used Anand viscoplastic constitutive function and Darveaux lifetime perdition model is programmed use Visual Basic language. With this software, effect of temperature, solder material, height, diameter and gap of solder joint, thickness, Young's modulus and CTE of substrate on solder joint lifetime are analyzed. Results show that these factors have different effect on solder joint life which is benefit to the optimization of package structure.
UR - https://www.scopus.com/pages/publications/78449273500
U2 - 10.1109/ICEPT.2010.5582746
DO - 10.1109/ICEPT.2010.5582746
M3 - 会议稿件
AN - SCOPUS:78449273500
SN - 9781424481422
T3 - Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010
SP - 1142
EP - 1146
BT - Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010
T2 - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010
Y2 - 16 August 2010 through 19 August 2010
ER -