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Latest advance on seamless metal-semiconductor contact with ultralow Schottky barrier in 2D-material-based devices

  • Shengyao Chen
  • , Shu Wang
  • , Cong Wang*
  • , Zhongchang Wang
  • , Qian Liu*
  • *此作品的通讯作者
  • National Center for Nanoscience and Technology
  • Nankai University
  • Beijing University of Chemical Technology
  • International Iberian Nanotechnology Laboratory

科研成果: 期刊稿件文献综述同行评审

摘要

2D-material semiconductors with unique photonic and optoelectronic properties process ultralow energy consumption and are naturally compatible to semiconductor fabrication process, which show great potential in many applications such as memristors, optoelectronic probers, energy devices, and catalytic system. Generally, electrode fabrication process inevitably introduces a non-Ohmic contact between the semiconductor and its electrodes due to the Schottky barrier and gap states, thus raising energy consumption and limiting device performance. Recently, seamless-contact technologies have been developed, which can turn the semiconductor-electrode contact to be Ohmic by eliminating gap states and Schottky barrier, thereby having fundamental implications on 2D-material-based devices. This work will review the recent progresses of the seamless contacts from both theory and experiment aspect, summarize the existing difficulties, exploring improvement of metal-semiconductor contact and propose future exploration direction. This review is timely and helpful to improve the performance of 2D-material-based devices by introducing seamless contact and approaching the Ohmic contact.

源语言英语
文章编号101372
期刊Nano Today
42
DOI
出版状态已出版 - 2月 2022
已对外发布

联合国可持续发展目标

此成果有助于实现下列可持续发展目标:

  1. 可持续发展目标 7 - 经济适用的清洁能源
    可持续发展目标 7 经济适用的清洁能源

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