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Laser-Triggered Degradation of Silicon Circuits by Lithiation and Moisture Uptake for On-Demand Transient Electronics

  • Shengnan Liu
  • , Xibo Wang
  • , Shangbin Liu
  • , Yuping Deng
  • , Bochen Zhao
  • , Huachun Wang
  • , Xing Sheng
  • , Lingyun Zhao
  • , Liu Wang*
  • , Peijian Zhang*
  • , Lan Yin*
  • *此作品的通讯作者
  • Tsinghua University
  • National Key Laboratory of Integrated Circuits and Microsystems

科研成果: 期刊稿件文章同行评审

摘要

Data security risks of unauthorized access of confidential information have attracted considerable attention. Transient electronics capable of physical disappearance or disintegration upon external stimuli could potentially offer an alternative solution at the device level. Despite great advances, smart, efficient, wireless, and nonrecoverable degradation of foundry-compatible silicon (Si)-integrated circuit (IC) chips remains a challenge. Herein, a laser-triggered degradation of Si circuits by lithiation and moisture uptake is proposed. By integrating IC chips with a small amount of lithium sources and a fluidic reservoir consisting of hygroscopic materials, on-demand, wireless, rapid, and complete degradation of Si IC chips built at 600 nm node is achieved upon activation by laser irradiation. This work paves a new route to accomplish smart, tether-free, and thorough degradation of devices compatible with existing foundry processes, offering an essential baseline for the development of intelligent transient electronics for secured hardware.

源语言英语
文章编号2300213
期刊Advanced Engineering Materials
25
12
DOI
出版状态已出版 - 6月 2023

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