Junction temperature measurement to optimize thermal design of LED arrays

Huaiyu Ye; Hongyu Tang; Stanley Leung; Cheng Qian; Xuejun Fan; Guoqi Zhang

doi:10.1109/SSLCHINA.2015.7360687

Junction temperature measurement to optimize thermal design of LED arrays

Huaiyu Ye
, Hongyu Tang
, Stanley Leung
, Cheng Qian
, Xuejun Fan
, Guoqi Zhang

Delft University of Technology
CAS - Institute of Semiconductors
Changzhou Institute of Technology Research for Solid State Lighting
Lamar University

科研成果: 书/报告/会议事项章节 › 会议稿件 › 同行评审

4 引用（Scopus）

摘要

The drive to increase electrical currents input, and to achieve high lumen output for High Brightness Light Emitting Diode (HB LED) has led to a series of thermal problems. Hence, thermal management is one of key design parameters as the temperature directly affecting the maximum light output, quality, reliability and life time. For LED arrays, the arrangement of chips will affect the thermal performance and junction temperature is very important in the design. However, because direct junction temperature determination is hard to detect due to the encapsulation, indirect methods are more preferred. Among them, the diode forward-voltage method is the most accurate one. Therefore, we used the diode forward-voltage method to optimize thermal design of LED arrays in this work.

源语言	英语
主期刊名	2015 12th China International Forum on Solid State Lighting, SSLCHINA 2015
出版商	Institute of Electrical and Electronics Engineers Inc.
页	47-51
页数	5
ISBN（电子版）	9781509001767
DOI	https://doi.org/10.1109/SSLCHINA.2015.7360687
出版状态	已出版 - 17 12月 2015
已对外发布	是
活动	12th China International Forum on Solid State Lighting, SSLCHINA 2015 - Shenzhen, 中国期限: 2 11月 2015 → 4 11月 2015

出版系列

姓名	2015 12th China International Forum on Solid State Lighting, SSLCHINA 2015

会议

会议	12th China International Forum on Solid State Lighting, SSLCHINA 2015
国家/地区	中国
市	Shenzhen
时期	2/11/15 → 4/11/15

访问文件

10.1109/SSLCHINA.2015.7360687

其它文件与链接

链接到 Scopus 的出版物

引用此

Ye, H., Tang, H., Leung, S., Qian, C., Fan, X., & Zhang, G. (2015). Junction temperature measurement to optimize thermal design of LED arrays. 在 2015 12th China International Forum on Solid State Lighting, SSLCHINA 2015 (页码 47-51). 文章 7360687 (2015 12th China International Forum on Solid State Lighting, SSLCHINA 2015). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/SSLCHINA.2015.7360687

@inproceedings{0dbf8f9da0504ad0bf5ec9213ce5a234,

title = "Junction temperature measurement to optimize thermal design of LED arrays",

abstract = "The drive to increase electrical currents input, and to achieve high lumen output for High Brightness Light Emitting Diode (HB LED) has led to a series of thermal problems. Hence, thermal management is one of key design parameters as the temperature directly affecting the maximum light output, quality, reliability and life time. For LED arrays, the arrangement of chips will affect the thermal performance and junction temperature is very important in the design. However, because direct junction temperature determination is hard to detect due to the encapsulation, indirect methods are more preferred. Among them, the diode forward-voltage method is the most accurate one. Therefore, we used the diode forward-voltage method to optimize thermal design of LED arrays in this work.",

author = "Huaiyu Ye and Hongyu Tang and Stanley Leung and Cheng Qian and Xuejun Fan and Guoqi Zhang",

note = "Publisher Copyright: {\textcopyright} 2015 IEEE.; 12th China International Forum on Solid State Lighting, SSLCHINA 2015 ; Conference date: 02-11-2015 Through 04-11-2015",

year = "2015",

month = dec,

day = "17",

doi = "10.1109/SSLCHINA.2015.7360687",

language = "英语",

series = "2015 12th China International Forum on Solid State Lighting, SSLCHINA 2015",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

pages = "47--51",

booktitle = "2015 12th China International Forum on Solid State Lighting, SSLCHINA 2015",

address = "美国",

}

Ye, H, Tang, H, Leung, S, Qian, C, Fan, X & Zhang, G 2015, Junction temperature measurement to optimize thermal design of LED arrays. 在 2015 12th China International Forum on Solid State Lighting, SSLCHINA 2015., 7360687, 2015 12th China International Forum on Solid State Lighting, SSLCHINA 2015, Institute of Electrical and Electronics Engineers Inc., 页码 47-51, 12th China International Forum on Solid State Lighting, SSLCHINA 2015, Shenzhen, 中国, 2/11/15. https://doi.org/10.1109/SSLCHINA.2015.7360687

Junction temperature measurement to optimize thermal design of LED arrays. / Ye, Huaiyu; Tang, Hongyu; Leung, Stanley 等.
2015 12th China International Forum on Solid State Lighting, SSLCHINA 2015. Institute of Electrical and Electronics Engineers Inc., 2015. 页码 47-51 7360687 (2015 12th China International Forum on Solid State Lighting, SSLCHINA 2015).

科研成果: 书/报告/会议事项章节 › 会议稿件 › 同行评审

TY - GEN

T1 - Junction temperature measurement to optimize thermal design of LED arrays

AU - Ye, Huaiyu

AU - Tang, Hongyu

AU - Leung, Stanley

AU - Qian, Cheng

AU - Fan, Xuejun

AU - Zhang, Guoqi

PY - 2015/12/17

Y1 - 2015/12/17

N2 - The drive to increase electrical currents input, and to achieve high lumen output for High Brightness Light Emitting Diode (HB LED) has led to a series of thermal problems. Hence, thermal management is one of key design parameters as the temperature directly affecting the maximum light output, quality, reliability and life time. For LED arrays, the arrangement of chips will affect the thermal performance and junction temperature is very important in the design. However, because direct junction temperature determination is hard to detect due to the encapsulation, indirect methods are more preferred. Among them, the diode forward-voltage method is the most accurate one. Therefore, we used the diode forward-voltage method to optimize thermal design of LED arrays in this work.

AB - The drive to increase electrical currents input, and to achieve high lumen output for High Brightness Light Emitting Diode (HB LED) has led to a series of thermal problems. Hence, thermal management is one of key design parameters as the temperature directly affecting the maximum light output, quality, reliability and life time. For LED arrays, the arrangement of chips will affect the thermal performance and junction temperature is very important in the design. However, because direct junction temperature determination is hard to detect due to the encapsulation, indirect methods are more preferred. Among them, the diode forward-voltage method is the most accurate one. Therefore, we used the diode forward-voltage method to optimize thermal design of LED arrays in this work.

UR - https://www.scopus.com/pages/publications/84962701504

U2 - 10.1109/SSLCHINA.2015.7360687

DO - 10.1109/SSLCHINA.2015.7360687

M3 - 会议稿件

AN - SCOPUS:84962701504

T3 - 2015 12th China International Forum on Solid State Lighting, SSLCHINA 2015

SP - 47

EP - 51

BT - 2015 12th China International Forum on Solid State Lighting, SSLCHINA 2015

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 12th China International Forum on Solid State Lighting, SSLCHINA 2015

Y2 - 2 November 2015 through 4 November 2015

ER -

Ye H, Tang H, Leung S, Qian C, Fan X, Zhang G. Junction temperature measurement to optimize thermal design of LED arrays. 在 2015 12th China International Forum on Solid State Lighting, SSLCHINA 2015. Institute of Electrical and Electronics Engineers Inc. 2015. 页码 47-51. 7360687. (2015 12th China International Forum on Solid State Lighting, SSLCHINA 2015). doi: 10.1109/SSLCHINA.2015.7360687

Junction temperature measurement to optimize thermal design of LED arrays

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