TY - JOUR
T1 - Investigation of the burnishing process with PCD tool on non-ferrous metals
AU - Luo, Hongyun
AU - Liu, Jianying
AU - Wang, Lijiang
AU - Zhong, Qunpeng
PY - 2005/3
Y1 - 2005/3
N2 - It is well known that the no-chip machining process, burnishing, can easily improve surface roughness, waviness and hardness. To get the practical useful parameters, the effects of various burnishing parameters (spindle speed, depth, feed, burnishing radius and lathe) on surface roughness and waviness of the non-ferrous components were studied experimentally with a theoretical analysis. The experiments were conducted with a simply designed cylindrical surfaced polycrystalline diamond tool developed by us. It was found that smaller parameters do not mean lower surface roughness or waviness and different optimum burnishing parameters can be got under different burnishing conditions.
AB - It is well known that the no-chip machining process, burnishing, can easily improve surface roughness, waviness and hardness. To get the practical useful parameters, the effects of various burnishing parameters (spindle speed, depth, feed, burnishing radius and lathe) on surface roughness and waviness of the non-ferrous components were studied experimentally with a theoretical analysis. The experiments were conducted with a simply designed cylindrical surfaced polycrystalline diamond tool developed by us. It was found that smaller parameters do not mean lower surface roughness or waviness and different optimum burnishing parameters can be got under different burnishing conditions.
KW - Burnishing process
KW - Cylindrical surfaced polycrystalline diamond (PCD) tool
KW - Optimum burnishing parameters surface roughness
KW - Surface waviness
UR - https://www.scopus.com/pages/publications/20644442232
U2 - 10.1007/s00170-003-1959-5
DO - 10.1007/s00170-003-1959-5
M3 - 文章
AN - SCOPUS:20644442232
SN - 0268-3768
VL - 25
SP - 454
EP - 459
JO - International Journal of Advanced Manufacturing Technology
JF - International Journal of Advanced Manufacturing Technology
IS - 5-6
ER -