Interfacial decoration of UHMWPE composites with SiC nanoparticles to improve their ballistic limitations

Ultra high modulus weight polyethylene (UHMWPE) fibers show great prospects in ballistic composites. However, the interface inertia of UHMWPE fibers results in poor interfacial adhesion between UHMWPE fibers and the matrix, which would lead to pre-failure of the laminates under ballistic impact. Introducing nanoparticles shows great prospects in enhancing interfacial bonding between UHMWPE fibers and the matrix, while there is still a lack of research about the reinforcement mechanism, and the issue of mass depositing nanoparticles in the interfacial phase needs to be addressed. Herein, various contents of SiC nanoparticles are introduced into the interfacial phase of the UHMWPE laminates by an industrialized sizing strategy. On one hand, the interfacial properties of the laminates are improved significantly because of the solidified interlocking between fibers, SiC nanoparticles, and the matrix, which boosts the transmission of stress waves and increases the energy adsorption in crack propagation. However, excessive nanoparticles will form new stress concentration, which decreases the interfacial properties in reverse. On the other hand, the introduction of inorganic SiC nanoparticles could increase the modulus of laminates, which would make the passivation of the bullet, weaken the shear effect of the bullet toward the composites, and increase the energy adsorption during the impact process. Highlights: The SiC nanoparticles are used to improve the interfacial properties of UHMWPE laminates. An industrialized sizing process is applied to load SiC nanoparticles on the surface of UHMWPE prepregs. Interfacial properties and ballistic impact limits of laminates are improved. Improvement of interfacial properties and increase of modulus are thought to be the main mechanisms to enhance ballistic limitation.