Interfacial Characteristic and Bonding Mechanism of Ag Nanoparticles on ENIG Surface

Hongqiang Zhang; Xiaoli Li; Siliang He; Wei Guo; Yongyou Cao; Hiroshi Nishikawa

doi:10.1109/TCPMT.2025.3648661

Interfacial Characteristic and Bonding Mechanism of Ag Nanoparticles on ENIG Surface

Hongqiang Zhang
, Xiaoli Li
, Siliang He^*
, Wei Guo^*
, Yongyou Cao^*
, Hiroshi Nishikawa

^*此作品的通讯作者

机械工程及自动化学院

Beihang University
Guilin University of Electronic Technology
Beijing NAURA Microelectronics Equipment Co. Ltd
The University of Osaka

科研成果: 期刊稿件 › 文章 › 同行评审

摘要

SiC chip and a direct bonding copper (DBC) substrate with electroless nickel/immersion gold (ENIG) surface were bonded by nano-Ag paste. Interdiffusion occurred between these Ag nanoparticles and the Au layer, and formed a continuous Ag-Au solid solution layer. Interdiffusion guaranteed good metallurgy while bringing about high porosity in the sintered layer. The Kirkendall effect can be eliminated by using the electroplated Ag surface, and the bonding strength can be further enhanced by 30%.

源语言	英语
页（从-至）	429-432
页数	4
期刊	IEEE Transactions on Components, Packaging and Manufacturing Technology
卷	16
期	2
DOI	https://doi.org/10.1109/TCPMT.2025.3648661
出版状态	已出版 - 2026

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abstract = "SiC chip and a direct bonding copper (DBC) substrate with electroless nickel/immersion gold (ENIG) surface were bonded by nano-Ag paste. Interdiffusion occurred between these Ag nanoparticles and the Au layer, and formed a continuous Ag-Au solid solution layer. Interdiffusion guaranteed good metallurgy while bringing about high porosity in the sintered layer. The Kirkendall effect can be eliminated by using the electroplated Ag surface, and the bonding strength can be further enhanced by 30\%.",

keywords = "Ag sintering, ENIG surface, nano-Ag paste",

author = "Hongqiang Zhang and Xiaoli Li and Siliang He and Wei Guo and Yongyou Cao and Hiroshi Nishikawa",

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AU - Zhang, Hongqiang

AU - Li, Xiaoli

AU - He, Siliang

AU - Guo, Wei

AU - Cao, Yongyou

AU - Nishikawa, Hiroshi

PY - 2026

Y1 - 2026

N2 - SiC chip and a direct bonding copper (DBC) substrate with electroless nickel/immersion gold (ENIG) surface were bonded by nano-Ag paste. Interdiffusion occurred between these Ag nanoparticles and the Au layer, and formed a continuous Ag-Au solid solution layer. Interdiffusion guaranteed good metallurgy while bringing about high porosity in the sintered layer. The Kirkendall effect can be eliminated by using the electroplated Ag surface, and the bonding strength can be further enhanced by 30%.

AB - SiC chip and a direct bonding copper (DBC) substrate with electroless nickel/immersion gold (ENIG) surface were bonded by nano-Ag paste. Interdiffusion occurred between these Ag nanoparticles and the Au layer, and formed a continuous Ag-Au solid solution layer. Interdiffusion guaranteed good metallurgy while bringing about high porosity in the sintered layer. The Kirkendall effect can be eliminated by using the electroplated Ag surface, and the bonding strength can be further enhanced by 30%.

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KW - ENIG surface

KW - nano-Ag paste

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DO - 10.1109/TCPMT.2025.3648661

M3 - 文章

AN - SCOPUS:105025819667

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JO - IEEE Transactions on Components, Packaging and Manufacturing Technology

JF - IEEE Transactions on Components, Packaging and Manufacturing Technology

IS - 2

ER -

Interfacial Characteristic and Bonding Mechanism of Ag Nanoparticles on ENIG Surface

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