TY - JOUR
T1 - Interface regulation of micro-sized sintered Ag-10Al composite based on in-situ surface modification and enhanced microstructure stability in power electronic packaging
AU - Huo, Fupeng
AU - Chen, Chuantong
AU - Zhang, Zheng
AU - Wang, Ye
AU - Suetake, Aiji
AU - Takeshita, Kazutaka
AU - Yamaguchi, Yoshiji
AU - Momose, Yashima
AU - Suganuma, Katsuaki
N1 - Publisher Copyright:
© 2024 The Authors
PY - 2024/4
Y1 - 2024/4
N2 - The increasing demand for high-power SiC semiconductors necessitate the development of a die attachment material that combines high-temperature resistance, reliability, and cost-effectiveness. In this study, a novel micro-sized composite, Ag-10Al paste, containing 10 wt% Al particles, was designed. A remarkable phenomenon, the ejection of ultrafine Ag nanoparticles from micron-sized Ag flakes, was observed for the first time. The phenomenon was utilized for the in-situ surface modification of Al. Subsequently, the microstructure and mechanical properties of the sintered Ag-10Al/direct bonded copper (DBC) joints were studied. Results indicated that the Ag-10Al composite exhibited superior microstructure stability compared to sintered Ag. The Ag/Al interface was systematically analyzed, revealing a unique Ag/nano Ag2O/Al2O3 amorphous/Al structure. This structure was formed through the Ag nanoparticle jetting effect of Ag flakes, achieving effective bonding between nano Ag2O and Al2O3 amorphous phases through mutual dissolution at the atomic level. Moreover, the sintered Ag-10Al joint demonstrated enhanced mechanical performance stability over the sintered Ag joint. After 1000 h aging at 300 ℃, the shear strength of the sintered Ag-10Al joint reached 34.1 MPa, meeting the requirements for power semiconductor packaging. In conclusion, the Ag-10Al composite paste was thoughtfully designed, excelling in both performance and cost-effectiveness.
AB - The increasing demand for high-power SiC semiconductors necessitate the development of a die attachment material that combines high-temperature resistance, reliability, and cost-effectiveness. In this study, a novel micro-sized composite, Ag-10Al paste, containing 10 wt% Al particles, was designed. A remarkable phenomenon, the ejection of ultrafine Ag nanoparticles from micron-sized Ag flakes, was observed for the first time. The phenomenon was utilized for the in-situ surface modification of Al. Subsequently, the microstructure and mechanical properties of the sintered Ag-10Al/direct bonded copper (DBC) joints were studied. Results indicated that the Ag-10Al composite exhibited superior microstructure stability compared to sintered Ag. The Ag/Al interface was systematically analyzed, revealing a unique Ag/nano Ag2O/Al2O3 amorphous/Al structure. This structure was formed through the Ag nanoparticle jetting effect of Ag flakes, achieving effective bonding between nano Ag2O and Al2O3 amorphous phases through mutual dissolution at the atomic level. Moreover, the sintered Ag-10Al joint demonstrated enhanced mechanical performance stability over the sintered Ag joint. After 1000 h aging at 300 ℃, the shear strength of the sintered Ag-10Al joint reached 34.1 MPa, meeting the requirements for power semiconductor packaging. In conclusion, the Ag-10Al composite paste was thoughtfully designed, excelling in both performance and cost-effectiveness.
KW - In-situ TEM
KW - Interface
KW - Microstructure
KW - Reliability
KW - Sintered Ag-Al composite
KW - Surface modification
UR - https://www.scopus.com/pages/publications/85188697716
U2 - 10.1016/j.matdes.2024.112863
DO - 10.1016/j.matdes.2024.112863
M3 - 文章
AN - SCOPUS:85188697716
SN - 0264-1275
VL - 240
JO - Materials and Design
JF - Materials and Design
M1 - 112863
ER -